{"id":1407,"date":"2025-09-11T05:28:53","date_gmt":"2025-09-11T05:28:53","guid":{"rendered":"https:\/\/weitai2.globaldeepsea.site\/product\/wafer-cassette\/"},"modified":"2026-04-29T15:33:49","modified_gmt":"2026-04-29T07:33:49","slug":"wafer-cassette","status":"publish","type":"product","link":"https:\/\/www.cn-semiconductorparts.com\/de\/product\/wafer-cassette\/","title":{"rendered":"Wafer Cassette"},"content":{"rendered":"
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Semicera\u2019s Wafer Cassette<\/strong> is a critical component in the semiconductor manufacturing process, designed to securely hold and transport delicate semiconductor wafers. The Wafer Cassette<\/strong> provides exceptional protection, ensuring that each wafer is kept free from contaminants and physical damage during handling, storage, and transportation.<\/span><\/p>\n

Constructed with high-purity, chemical-resistant materials, the Semicera Wafer Cassette<\/strong> guarantees the highest levels of cleanliness and durability, essential for maintaining the integrity of wafers at every stage of production. The precision engineering of these cassettes allows for seamless integration with automated handling systems, minimizing the risk of contamination and mechanical damage.<\/span><\/p>\n

The design of the Wafer Cassette<\/strong> also supports optimal airflow and temperature control, which is crucial for processes that require specific environmental conditions. Whether used in cleanrooms or during thermal processing, the Semicera Wafer Cassette<\/strong> is engineered to meet the stringent demands of the semiconductor industry, providing reliable and consistent performance to enhance manufacturing efficiency and product quality.<\/span><\/p>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n

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\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
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Artikel<\/p>\n<\/td>\n

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Produktion<\/p>\n<\/td>\n

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Forschung<\/p>\n<\/td>\n

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Dummy<\/p>\n<\/td>\n<\/tr>\n

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Kristallparameter<\/p>\n<\/td>\n<\/tr>\n

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Polytype<\/p>\n<\/td>\n

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4H<\/p>\n<\/td>\n<\/tr>\n

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Oberfl\u00e4chenorientierungsfehler<\/p>\n<\/td>\n

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4\u00b10.15\u00b0<\/p>\n<\/td>\n<\/tr>\n

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Elektrische Parameter<\/p>\n<\/td>\n<\/tr>\n

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Dopant<\/p>\n<\/td>\n

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Stickstoff vom Typ N<\/p>\n<\/td>\n<\/tr>\n

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Widerstand<\/p>\n<\/td>\n

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0,015-0.025OHM \u00b7 cm<\/p>\n<\/td>\n<\/tr>\n

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Mechanische Parameter<\/p>\n<\/td>\n<\/tr>\n

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Durchmesser<\/p>\n<\/td>\n

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150,0 \u00b1 0,2 mm<\/p>\n<\/td>\n<\/tr>\n

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Dicke<\/p>\n<\/td>\n

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350 \u00b1 25 \u00b5m<\/p>\n<\/td>\n<\/tr>\n

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Prim\u00e4re flache Orientierung<\/p>\n<\/td>\n

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[1-100]\u00b15\u00b0<\/p>\n<\/td>\n<\/tr>\n

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Prim\u00e4re flache L\u00e4nge<\/p>\n<\/td>\n

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47,5 \u00b1 1,5 mm<\/p>\n<\/td>\n<\/tr>\n

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Sekund\u00e4re flache<\/p>\n<\/td>\n

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Keiner<\/p>\n<\/td>\n<\/tr>\n

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Ttv<\/p>\n<\/td>\n

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\u22645 \u00b5m<\/p>\n<\/td>\n

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\u226410 \u00b5m<\/p>\n<\/td>\n

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\u226415 \u00b5m<\/p>\n<\/td>\n<\/tr>\n

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LTV<\/p>\n<\/td>\n

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\u22643 \u03bcm (5 mm*5 mm)<\/p>\n<\/td>\n

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\u22645 \u03bcm (5 mm*5 mm)<\/p>\n<\/td>\n

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\u226410 \u03bcm (5 mm*5 mm)<\/p>\n<\/td>\n<\/tr>\n

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Bogen<\/p>\n<\/td>\n

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-15 \u03bcm ~ 15 \u03bcm<\/p>\n<\/td>\n

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-35 \u03bcm ~ 35 \u03bcm<\/p>\n<\/td>\n

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-45 \u03bcm ~ 45 \u03bcm<\/p>\n<\/td>\n<\/tr>\n

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Kette<\/p>\n<\/td>\n

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\u226435 \u00b5m<\/p>\n<\/td>\n

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\u226445 \u00b5m<\/p>\n<\/td>\n

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\u226455 \u00b5m<\/p>\n<\/td>\n<\/tr>\n

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Front (Si-Face) Rauheit (AFM)<\/p>\n<\/td>\n

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Ra \u2264 0,2 nm (5 & mgr; m*5 \u03bcm)<\/p>\n<\/td>\n<\/tr>\n

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Struktur<\/p>\n<\/td>\n<\/tr>\n

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Mikropipe -Dichte<\/p>\n<\/td>\n

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<1 EA\/CM2<\/p>\n<\/td>\n

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<10 EA\/CM2<\/p>\n<\/td>\n

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<15 EA\/CM2<\/p>\n<\/td>\n<\/tr>\n

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Metallverunreinigungen<\/p>\n<\/td>\n

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\u22645E10atoms\/cm2<\/p>\n<\/td>\n

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N \/ A<\/p>\n<\/td>\n<\/tr>\n

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BPD<\/p>\n<\/td>\n

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\u22641500 EA\/CM2<\/p>\n<\/td>\n

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\u22643000 EA\/CM2<\/p>\n<\/td>\n

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N \/ A<\/p>\n<\/td>\n<\/tr>\n

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TSD<\/p>\n<\/td>\n

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\u2264500 EA\/CM2<\/p>\n<\/td>\n

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\u22641000 EA\/CM2<\/p>\n<\/td>\n

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N \/ A<\/p>\n<\/td>\n<\/tr>\n

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Frontqualit\u00e4t<\/p>\n<\/td>\n<\/tr>\n

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Front<\/p>\n<\/td>\n

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Si<\/p>\n<\/td>\n<\/tr>\n

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Oberfl\u00e4chenbeschaffung<\/p>\n<\/td>\n

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Si-Face CMP<\/p>\n<\/td>\n<\/tr>\n

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Partikel<\/p>\n<\/td>\n

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\u226460ea\/Wafer (Gr\u00f6\u00dfe \u2265 0,3 \u03bcm)<\/p>\n<\/td>\n

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N \/ A<\/p>\n<\/td>\n<\/tr>\n

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Kratzer<\/p>\n<\/td>\n

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\u22645ea\/mm. Kumulative L\u00e4nge \u2264 Diameter<\/p>\n<\/td>\n

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Kumulative L\u00e4nge \u2264 2*Durchmesser<\/p>\n<\/td>\n

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N \/ A<\/p>\n<\/td>\n<\/tr>\n

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Orangenschale\/Pits\/Flecken\/Streifen\/Risse\/Kontamination<\/p>\n<\/td>\n

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Keiner<\/p>\n<\/td>\n

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N \/ A<\/p>\n<\/td>\n<\/tr>\n

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Kantenchips\/Eingeweide\/Fraktur-\/Sechskantplatten<\/p>\n<\/td>\n

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Keiner<\/p>\n<\/td>\n<\/tr>\n

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Polytyperbereiche<\/p>\n<\/td>\n

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Keiner<\/p>\n<\/td>\n

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Kumulative Fl\u00e4che \u2264 2010TP3T<\/p>\n<\/td>\n

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Kumulative Fl\u00e4che \u2264 30%<\/p>\n<\/td>\n<\/tr>\n

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Frontlasermarkierung<\/p>\n<\/td>\n

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Keiner<\/p>\n<\/td>\n<\/tr>\n

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R\u00fcckenqualit\u00e4t<\/p>\n<\/td>\n<\/tr>\n

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R\u00fcckbeschluss<\/p>\n<\/td>\n

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C-Face CMP<\/p>\n<\/td>\n<\/tr>\n

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Kratzer<\/p>\n<\/td>\n

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\u22645ea\/mm, kumulative L\u00e4nge \u2264 2*Durchmesser<\/p>\n<\/td>\n

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N \/ A<\/p>\n<\/td>\n<\/tr>\n

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R\u00fcckenfehler (Kantenchips\/Eingebiete)<\/p>\n<\/td>\n

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Keiner<\/p>\n<\/td>\n<\/tr>\n

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R\u00fcckenrauheit<\/p>\n<\/td>\n

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Ra \u2264 0,2 nm (5 & mgr; m*5 \u03bcm)<\/p>\n<\/td>\n<\/tr>\n

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R\u00fcckmarkierung von Laser<\/p>\n<\/td>\n

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1 mm (von der Oberkante)<\/p>\n<\/td>\n<\/tr>\n

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Rand<\/p>\n<\/td>\n<\/tr>\n

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Rand<\/p>\n<\/td>\n

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Chamfer<\/p>\n<\/td>\n<\/tr>\n

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Packaging<\/p>\n<\/td>\n<\/tr>\n

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Packaging<\/p>\n<\/td>\n

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Epi-ready with vacuum packaging<\/p>\n

Multi-wafer cassette packaging<\/p>\n<\/td>\n<\/tr>\n

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*Notes\uff1a \u201cNA\u201d means no request Items not mentioned may refer to SEMI-STD.<\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n

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\"tech_1_2_size\" <\/img><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n
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\"SiC <\/img><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"

Wafer Cassette\u2013 Precision-engineered for the safe handling and storage of semiconductor wafers, ensuring optimal protection and cleanliness throughout the manufacturing process.<\/p>","protected":false},"featured_media":622,"comment_status":"closed","ping_status":"open","template":"","meta":[],"product_brand":[],"product_cat":[53,26],"product_tag":[],"class_list":{"0":"post-1407","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-cassette","7":"product_cat-wafer","9":"first","10":"instock","11":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.cn-semiconductorparts.com\/de\/wp-json\/wp\/v2\/product\/1407","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.cn-semiconductorparts.com\/de\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.cn-semiconductorparts.com\/de\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/de\/wp-json\/wp\/v2\/comments?post=1407"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/de\/wp-json\/wp\/v2\/media\/622"}],"wp:attachment":[{"href":"https:\/\/www.cn-semiconductorparts.com\/de\/wp-json\/wp\/v2\/media?parent=1407"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/de\/wp-json\/wp\/v2\/product_brand?post=1407"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/de\/wp-json\/wp\/v2\/product_cat?post=1407"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/de\/wp-json\/wp\/v2\/product_tag?post=1407"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}