4 Inch N-type SiC Substrate

Semicera’s 4 Inch N-type SiC Substrates are meticulously designed for superior electrical and thermal performance in power electronics and high-frequency applications. These substrates offer excellent conductivity and stability, making them ideal for next-generation semiconductor devices. Trust Semicera for precision and quality in advanced materials.

Semicera’s 4 Inch N-type SiC Substrates are crafted to meet the exacting standards of the semiconductor industry. These substrates provide a high-performance foundation for a wide range of electronic applications, offering exceptional conductivity and thermal properties.

The N-type doping of these SiC substrates enhances their electrical conductivity, making them particularly suitable for high-power and high-frequency applications. This property allows for the efficient operation of devices such as diodes, transistors, and amplifiers, where minimizing energy loss is crucial.

Semicera utilizes state-of-the-art manufacturing processes to ensure that each substrate exhibits excellent surface quality and uniformity. This precision is critical for applications in power electronics, microwave devices, and other technologies that demand reliable performance under extreme conditions.

Incorporating Semicera’s N-type SiC substrates into your production line means benefiting from materials that offer superior heat dissipation and electrical stability. These substrates are ideal for creating components that require durability and efficiency, such as power conversion systems and RF amplifiers.

By choosing Semicera’s 4 Inch N-type SiC Substrates, you are investing in a product that combines innovative material science with meticulous craftsmanship. Semicera continues to lead the industry by providing solutions that support the development of cutting-edge semiconductor technologies, ensuring high performance and reliability.

Elementos

Producción

Investigación

Ficticio

Parámetros de cristal

Politito

4H

Error de orientación de la superficie

4±0.15°

Parámetros eléctricos

Dopante

nitrógeno de tipo N

Resistividad

0.015-0.025ohm · cm

Parámetros mecánicos

Diámetro

150.0 ± 0.2 mm

Espesor

350 ± 25 µm

Orientación plana primaria

[1-100]±5°

Longitud plana primaria

47.5 ± 1.5 mm

Plano secundario

Ninguno

TTV

≤5 µm

≤10 µm

≤15 µm

LTV

≤3 μm (5 mm*5 mm)

≤5 μm (5 mm*5 mm)

≤10 μm (5 mm*5 mm)

Arco

-15 μm ~ 15 μm

-35 μm ~ 35 μm

-45 μm ~ 45 μm

Urdimbre

≤35 µm

≤45 µm

≤55 µm

Rugosidad delantera (SI-FACE) (AFM)

RA≤0.2Nm (5 μm*5 μm)

Estructura

Densidad de micropipe

<1 ea/cm2

<10 ea/cm2

<15 ea/cm2

Impurezas de metal

≤5E10atoms/cm2

N / A

BPD

≤1500 ea/cm2

≤3000 ea/cm2

N / A

TSD

≤500 ea/cm2

≤1000 ea/cm2

N / A

Calidad frontal

Frente

Si

Acabado superficial

SI-FACE CMP

Partículas

≤60ea/oblea (tamaño ≥0.3 μm)

N / A

Arañazos

≤5ea/mm. Longitud acumulativa ≤diameter

Longitud acumulativa ≤2*diámetro

N / A

Peel de naranja/pits/manchas/estrías/grietas/contaminación

Ninguno

N / A

Chips de borde/sangría/placas hexagonales

Ninguno

Áreas de politype

Ninguno

Área acumulada ≤20%

Área acumulada ≤30%

Marcado láser delantero

Ninguno

Calidad espalda

Final

CMP C-FACE

Arañazos

≤5EA/mm, longitud acumulativa ≤2*diámetro

N / A

Defectos posteriores (chips/muescas de borde)

Ninguno

Rugosidad

RA≤0.2Nm (5 μm*5 μm)

Marcado láser de espalda

1 mm (desde el borde superior)

Borde

Borde

Chaflán

Embalaje

Embalaje

Lista de EPI con embalaje de vacío

Embalaje de cassette de múltiples obras

*Notas: "NA" significa que ningún elemento de solicitud no mencionado puede referirse a SEMI-STD.

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