Silicon Carbide Epitaxy

Silicon Carbide Epitaxy– High-quality epitaxial layers tailored for advanced semiconductor applications, offering superior performance and reliability for power electronics and optoelectronic devices.

Semicera’s Silicon Carbide Epitaxy is engineered to meet the rigorous demands of modern semiconductor applications. By utilizing advanced epitaxial growth techniques, we ensure that each silicon carbide layer exhibits exceptional crystalline quality, uniformity, and minimal defect density. These characteristics are crucial for developing high-performance power electronics, where efficiency and thermal management are paramount.

The Silicon Carbide Epitaxy process at Semicera is optimized to produce epitaxial layers with precise thickness and doping control, ensuring consistent performance across a range of devices. This level of precision is essential for applications in electric vehicles, renewable energy systems, and high-frequency communications, where reliability and efficiency are critical.

Moreover, Semicera’s Silicon Carbide Epitaxy offers enhanced thermal conductivity and higher breakdown voltage, making it the preferred choice for devices that operate under extreme conditions. These properties contribute to longer device lifetimes and improved overall system efficiency, particularly in high-power and high-temperature environments.

Semicera also provides customization options for Silicon Carbide Epitaxy, allowing for tailored solutions that meet specific device requirements. Whether for research or large-scale production, our epitaxial layers are designed to support the next generation of semiconductor innovations, enabling the development of more powerful, efficient, and reliable electronic devices.

By integrating cutting-edge technology and stringent quality control processes, Semicera ensures that our Silicon Carbide Epitaxy products not only meet but exceed industry standards. This commitment to excellence makes our epitaxial layers the ideal foundation for advanced semiconductor applications, paving the way for breakthroughs in power electronics and optoelectronics.

Elementos

Producción

Investigación

Ficticio

Parámetros de cristal

Politito

4H

Error de orientación de la superficie

4±0.15°

Parámetros eléctricos

Dopante

nitrógeno de tipo N

Resistividad

0.015-0.025ohm · cm

Parámetros mecánicos

Diámetro

150.0 ± 0.2 mm

Espesor

350 ± 25 µm

Orientación plana primaria

[1-100]±5°

Longitud plana primaria

47.5 ± 1.5 mm

Plano secundario

Ninguno

TTV

≤5 µm

≤10 µm

≤15 µm

LTV

≤3 μm (5 mm*5 mm)

≤5 μm (5 mm*5 mm)

≤10 μm (5 mm*5 mm)

Arco

-15 μm ~ 15 μm

-35 μm ~ 35 μm

-45 μm ~ 45 μm

Urdimbre

≤35 µm

≤45 µm

≤55 µm

Rugosidad delantera (SI-FACE) (AFM)

RA≤0.2Nm (5 μm*5 μm)

Estructura

Densidad de micropipe

<1 ea/cm2

<10 ea/cm2

<15 ea/cm2

Impurezas de metal

≤5E10atoms/cm2

N / A

BPD

≤1500 ea/cm2

≤3000 ea/cm2

N / A

TSD

≤500 ea/cm2

≤1000 ea/cm2

N / A

Calidad frontal

Frente

Si

Acabado superficial

SI-FACE CMP

Partículas

≤60ea/oblea (tamaño ≥0.3 μm)

N / A

Arañazos

≤5ea/mm. Longitud acumulativa ≤diameter

Longitud acumulativa ≤2*diámetro

N / A

Peel de naranja/pits/manchas/estrías/grietas/contaminación

Ninguno

N / A

Chips de borde/sangría/placas hexagonales

Ninguno

Áreas de politype

Ninguno

Área acumulada ≤20%

Área acumulada ≤30%

Marcado láser delantero

Ninguno

Calidad espalda

Final

CMP C-FACE

Arañazos

≤5EA/mm, longitud acumulativa ≤2*diámetro

N / A

Defectos posteriores (chips/muescas de borde)

Ninguno

Rugosidad

RA≤0.2Nm (5 μm*5 μm)

Marcado láser de espalda

1 mm (desde el borde superior)

Borde

Borde

Chaflán

Embalaje

Embalaje

Lista de EPI con embalaje de vacío

Embalaje de cassette de múltiples obras

*Notas: "NA" significa que ningún elemento de solicitud no mencionado puede referirse a SEMI-STD.

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Obleas de sic

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