Wafer Cassette– Precision-engineered for the safe handling and storage of semiconductor wafers, ensuring optimal protection and cleanliness throughout the manufacturing process.
Semicera’s Wafer Cassette is a critical component in the semiconductor manufacturing process, designed to securely hold and transport delicate semiconductor wafers. The Wafer Cassette provides exceptional protection, ensuring that each wafer is kept free from contaminants and physical damage during handling, storage, and transportation.
Constructed with high-purity, chemical-resistant materials, the Semicera Wafer Cassette guarantees the highest levels of cleanliness and durability, essential for maintaining the integrity of wafers at every stage of production. The precision engineering of these cassettes allows for seamless integration with automated handling systems, minimizing the risk of contamination and mechanical damage.
The design of the Wafer Cassette also supports optimal airflow and temperature control, which is crucial for processes that require specific environmental conditions. Whether used in cleanrooms or during thermal processing, the Semicera Wafer Cassette is engineered to meet the stringent demands of the semiconductor industry, providing reliable and consistent performance to enhance manufacturing efficiency and product quality.
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Articles |
Production |
Recherche |
Factice |
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Paramètres de cristal |
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Polytype |
4H |
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Erreur d'orientation de la surface |
4±0.15° |
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Paramètres électriques |
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Dopant |
azote de type N |
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Résistivité |
0,015-0.025ohm · cm |
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Paramètres mécaniques |
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Diamètre |
150,0 ± 0,2 mm |
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Épaisseur |
350 ± 25 µm |
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Orientation plate primaire |
[1-100]±5° |
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Longueur plate primaire |
47,5 ± 1,5 mm |
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Plat secondaire |
Aucun |
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TTV |
≤5 µm |
≤10 µm |
≤15 µm |
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LTV |
≤3 μm (5 mm * 5 mm) |
≤5 μm (5 mm * 5 mm) |
≤10 μm (5 mm * 5 mm) |
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Arc |
-15 μm ~ 15μm |
-35 μm ~ 35 μm |
-45 μm ~ 45 μm |
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Chaîne |
≤35 µm |
≤45 µm |
≤55 µm |
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Rugosité avant (si-face) (AFM) |
Ra≤0,2 nm (5 μm * 5 μm) |
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Structure |
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Densité de micro- |
<1 ea / cm2 |
<10 ea / cm2 |
<15 ea / cm2 |
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Impuretés métalliques |
≤5E10atoms/cm2 |
N / A |
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BPB |
≤1500 ea / cm2 |
≤3000 ea / cm2 |
N / A |
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TSD |
≤500 ea / cm2 |
≤1000 ea / cm2 |
N / A |
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Qualité avant |
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Devant |
Si |
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Finition de surface |
CMP SI-FACE |
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Particules |
≤60ea / plaquette (taille 0,3 μm) |
N / A |
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Rayures |
≤5EA / MM. Longueur cumulative ≤ diamètre |
Longueur cumulatif ≤2 * diamètre |
N / A |
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PELLE / PEPES ORANGE / TAPPES / COMMENTS / CRESCHES / CONTAMINATION |
Aucun |
N / A |
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Coups de bord / retraits / fracture / plaques hexagonales |
Aucun |
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Zones de polytype |
Aucun |
Zone cumulative≤20% |
Zone cumulative ≤ 30% |
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Marquage laser avant |
Aucun |
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Qualité du dos |
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Finition arrière |
CMP C-FACE |
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Rayures |
≤5ea / mm, longueur cumulative≤2 * diamètre |
N / A |
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Défauts arrière (puces de bord / retraits) |
Aucun |
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Rugosité du dos |
Ra≤0,2 nm (5 μm * 5 μm) |
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Marquage laser arrière |
1 mm (du bord supérieur) |
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Bord |
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Bord |
Chanfreiner |
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Conditionnement |
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Conditionnement |
Préparé en épi avec un emballage sous vide Emballage de cassette multi-wafer |
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*Remarques: «NA» signifie qu'aucun élément de demande non mentionné ne peut se référer au semi-std. |
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