Semicera’s 4″, 6″, and 8″ N-type SiC Ingots are the cornerstone for high-power and high-frequency semiconductor devices. Offering superior electrical properties and thermal conductivity, these ingots are crafted to support the production of reliable and efficient electronic components. Trust Semicera for unmatched quality and performance.
Semicera’s 4″, 6″, and 8″ N-type SiC Ingots represent a breakthrough in semiconductor materials, designed to meet the increasing demands of modern electronic and power systems. These ingots provide a robust and stable foundation for various semiconductor applications, ensuring optimal performance and longevity.
Our N-type SiC ingots are produced using advanced manufacturing processes that enhance their electrical conductivity and thermal stability. This makes them ideal for high-power and high-frequency applications, such as inverters, transistors, and other power electronic devices where efficiency and reliability are paramount.
The precise doping of these ingots ensures that they offer consistent and repeatable performance. This consistency is critical for developers and manufacturers who are pushing the boundaries of technology in fields like aerospace, automotive, and telecommunications. Semicera’s SiC ingots enable the production of devices that operate efficiently under extreme conditions.
Choosing Semicera’s N-type SiC Ingots means integrating materials that can handle high temperatures and high electrical loads with ease. These ingots are particularly suited for creating components that require excellent thermal management and high-frequency operation, such as RF amplifiers and power modules.
By opting for Semicera’s 4″, 6″, and 8″ N-type SiC Ingots, you are investing in a product that combines exceptional material properties with the precision and reliability demanded by cutting-edge semiconductor technologies. Semicera continues to lead the industry by providing innovative solutions that drive the advancement of electronic device manufacturing.
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Elementi |
Produzione |
Ricerca |
Manichino |
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Parametri cristallini |
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Politipo |
4H |
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Errore di orientamento della superficie |
4±0.15° |
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Parametri elettrici |
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Drogante |
azoto di tipo n |
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Resistività |
0,015-0,025ohm · cm |
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Parametri meccanici |
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Diametro |
150,0 ± 0,2 mm |
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Spessore |
350 ± 25 µm |
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Orientamento piatto primario |
[1-100]±5° |
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Lunghezza piatta primaria |
47,5 ± 1,5 mm |
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Piatto secondario |
Nessuno |
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TTV |
≤5 µm |
≤10 µm |
≤15 µm |
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LTV |
≤3 μm (5mm*5mm) |
≤5 μm (5 mm*5 mm) |
≤10 μm (5 mm*5 mm) |
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Arco |
-15μm ~ 15μm |
-35μm ~ 35 μm |
-45μm ~ 45μm |
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Ordito |
≤35 µm |
≤45 µm |
≤55 µm |
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Front (Si-Face) Rughess (AFM) |
RA≤0,2 nm (5μm*5μm) |
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Struttura |
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Densità di micrivipe |
<1 ea/cm2 |
<10 ea/cm2 |
<15 ea/cm2 |
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Impurità dei metalli |
≤5E10atoms/cm2 |
N / A |
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BPD |
≤1500 ea/cm2 |
≤3000 ea/cm2 |
N / A |
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TSD |
≤500 ea/cm2 |
≤1000 ea/cm2 |
N / A |
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Qualità anteriore |
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Davanti |
Si |
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Finitura superficiale |
Si-Face CMP |
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Particelle |
≤60ea/wafer (dimensione≥0,3μm) |
N / A |
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Graffi |
≤5ea/mm. Lunghezza cumulativa ≤Diameter |
Diametro cumulativo della lunghezza ≤2* |
N / A |
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Buccia/pozzi/macchie/striature/crepe/contaminazione |
Nessuno |
N / A |
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Bordo chips/riendi/frattura/piastre esadecimale |
Nessuno |
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Aree politepi |
Nessuno |
Area cumulativa≤20% |
Area cumulativa≤30% |
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Marcatura laser anteriore |
Nessuno |
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Qualità alla schiena |
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Finitura posteriore |
C-FACE CMP |
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Graffi |
≤5ea/mm, lunghezza cumulativa≤2*diametro |
N / A |
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Difetti posteriori (bordo chip/rientri) |
Nessuno |
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Rugosità posteriore |
RA≤0,2 nm (5μm*5μm) |
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Marcatura laser sul retro |
1 mm (dal bordo superiore) |
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Bordo |
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Bordo |
Smussare |
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Confezione |
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Confezione |
Prepasto EPI con imballaggio a vuoto Packaging a cassette multi-wafer |
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*Note : “NA” significa che nessuna richiesta di richiesta non menzionata può fare riferimento a semi-std. |
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