2″ Gallium Oxide Substrates

2″ Gallium Oxide Substrates– Optimize your semiconductor devices with Semicera’s high-quality 2″ Gallium Oxide Substrates, engineered for superior performance in power electronics and UV applications.

Semicera is excited to offer 2″ Gallium Oxide Substrates, a cutting-edge material designed to enhance the performance of advanced semiconductor devices. These substrates, made from Gallium Oxide (Ga2O3), feature an ultra-wide bandgap, making them an ideal choice for high-power, high-frequency, and UV optoelectronic applications.

 

Caratteristiche chiave:

       •  Ultra-Wide Bandgap: IL 2″ Gallium Oxide Substrates provide an outstanding bandgap of approximately 4.8 eV, allowing for higher voltage and temperature operation, far exceeding the capabilities of traditional semiconductor materials like silicon.

       •  Exceptional Breakdown Voltage: These substrates enable devices to handle significantly higher voltages, making them perfect for power electronics, especially in high-voltage applications.

       •  Excellent Thermal Conductivity: With superior thermal stability, these substrates maintain consistent performance even in extreme thermal environments, ideal for high-power and high-temperature applications.

       •  High-Quality Material: IL 2″ Gallium Oxide Substrates offer low defect densities and high crystalline quality, ensuring the reliable and efficient performance of your semiconductor devices.

       •  Applicazioni versatili: These substrates are suited for a range of applications, including power transistors, Schottky diodes, and UV-C LED devices, offering a robust foundation for both power and optoelectronic innovations.

 

Unlock the full potential of your semiconductor devices with Semicera’s 2″ Gallium Oxide Substrates. Our substrates are designed to meet the demanding needs of today’s advanced applications, ensuring high performance, reliability, and efficiency. Choose Semicera for state-of-the-art semiconductor materials that drive innovation.

Elementi

Produzione

Ricerca

Manichino

Parametri cristallini

Politipo

4H

Errore di orientamento della superficie

4±0.15°

Parametri elettrici

Drogante

azoto di tipo n

Resistività

0,015-0,025ohm · cm

Parametri meccanici

Diametro

150,0 ± 0,2 mm

Spessore

350 ± 25 µm

Orientamento piatto primario

[1-100]±5°

Lunghezza piatta primaria

47,5 ± 1,5 mm

Piatto secondario

Nessuno

TTV

≤5 µm

≤10 µm

≤15 µm

LTV

≤3 μm (5mm*5mm)

≤5 μm (5 mm*5 mm)

≤10 μm (5 mm*5 mm)

Arco

-15μm ~ 15μm

-35μm ~ 35 μm

-45μm ~ 45μm

Ordito

≤35 µm

≤45 µm

≤55 µm

Front (Si-Face) Rughess (AFM)

RA≤0,2 nm (5μm*5μm)

Struttura

Densità di micrivipe

<1 ea/cm2

<10 ea/cm2

<15 ea/cm2

Impurità dei metalli

≤5E10atoms/cm2

N / A

BPD

≤1500 ea/cm2

≤3000 ea/cm2

N / A

TSD

≤500 ea/cm2

≤1000 ea/cm2

N / A

Qualità anteriore

Davanti

Si

Finitura superficiale

Si-Face CMP

Particelle

≤60ea/wafer (dimensione≥0,3μm)

N / A

Graffi

≤5ea/mm. Lunghezza cumulativa ≤Diameter

Diametro cumulativo della lunghezza ≤2*

N / A

Buccia/pozzi/macchie/striature/crepe/contaminazione

Nessuno

N / A

Bordo chips/riendi/frattura/piastre esadecimale

Nessuno

Aree politepi

Nessuno

Area cumulativa≤20%

Area cumulativa≤30%

Marcatura laser anteriore

Nessuno

Qualità alla schiena

Finitura posteriore

C-FACE CMP

Graffi

≤5ea/mm, lunghezza cumulativa≤2*diametro

N / A

Difetti posteriori (bordo chip/rientri)

Nessuno

Rugosità posteriore

RA≤0,2 nm (5μm*5μm)

Marcatura laser sul retro

1 mm (dal bordo superiore)

Bordo

Bordo

Smussare

Confezione

Confezione

Prepasto EPI con imballaggio a vuoto

Packaging a cassette multi-wafer

*Note : “NA” significa che nessuna richiesta di richiesta non menzionata può fare riferimento a semi-std.

tech_1_2_size

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