Gan epitaxy

GaN Epitaxy is a cornerstone in the production of high-performance semiconductor devices, offering exceptional efficiency, thermal stability, and reliability. Semicera’s GaN Epitaxy solutions are tailored to meet the demands of cutting-edge applications, ensuring superior quality and consistency in every layer.

Semicera proudly presents its cutting-edge Gan epitaxy services, designed to meet the ever-evolving needs of the semiconductor industry. Gallium nitride (GaN) is a material known for its exceptional properties, and our epitaxial growth processes ensure that these benefits are fully realized in your devices.

High-Performance GaN Layers Semicera specializes in the production of high-quality Gan epitaxy layers, offering unparalleled material purity and structural integrity. These layers are critical for a variety of applications, from power electronics to optoelectronics, where superior performance and reliability are essential. Our precision growth techniques ensure that each GaN layer meets the exacting standards required for cutting-edge devices.

Optimized for Efficiency IL Gan epitaxy provided by Semicera is specifically engineered to enhance the efficiency of your electronic components. By delivering low-defect, high-purity GaN layers, we enable devices to operate at higher frequencies and voltages, with reduced power loss. This optimization is key for applications such as high-electron-mobility transistors (HEMTs) and light-emitting diodes (LEDs), where efficiency is paramount.

Versatile Application Potential Semicera’s Gan epitaxy is versatile, catering to a broad range of industries and applications. Whether you are developing power amplifiers, RF components, or laser diodes, our GaN epitaxial layers provide the foundation needed for high-performance, reliable devices. Our process can be tailored to meet specific requirements, ensuring that your products achieve optimal results.

Commitment to Quality Quality is the cornerstone of Semicera’s approach to Gan epitaxy. We use advanced epitaxial growth technologies and rigorous quality control measures to produce GaN layers that exhibit excellent uniformity, low defect densities, and superior material properties. This commitment to quality ensures that your devices not only meet but exceed industry standards.

Innovative Growth Techniques Semicera is at the forefront of innovation in the field of Gan epitaxy. Our team continuously explores new methods and technologies to improve the growth process, delivering GaN layers with enhanced electrical and thermal characteristics. These innovations translate into better-performing devices, capable of meeting the demands of next-generation applications.

Customized Solutions for Your Projects Recognizing that each project has unique requirements, Semicera offers customized Gan epitaxy solutions. Whether you need specific doping profiles, layer thicknesses, or surface finishes, we work closely with you to develop a process that meets your exact needs. Our goal is to provide you with GaN layers that are precisely engineered to support your device’s performance and reliability.

Elementi

Produzione

Ricerca

Manichino

Parametri cristallini

Politipo

4H

Errore di orientamento della superficie

4±0.15°

Parametri elettrici

Drogante

azoto di tipo n

Resistività

0,015-0,025ohm · cm

Parametri meccanici

Diametro

150,0 ± 0,2 mm

Spessore

350 ± 25 µm

Orientamento piatto primario

[1-100]±5°

Lunghezza piatta primaria

47,5 ± 1,5 mm

Piatto secondario

Nessuno

TTV

≤5 µm

≤10 µm

≤15 µm

LTV

≤3 μm (5mm*5mm)

≤5 μm (5 mm*5 mm)

≤10 μm (5 mm*5 mm)

Arco

-15μm ~ 15μm

-35μm ~ 35 μm

-45μm ~ 45μm

Ordito

≤35 µm

≤45 µm

≤55 µm

Front (Si-Face) Rughess (AFM)

RA≤0,2 nm (5μm*5μm)

Struttura

Densità di micrivipe

<1 ea/cm2

<10 ea/cm2

<15 ea/cm2

Impurità dei metalli

≤5E10atoms/cm2

N / A

BPD

≤1500 ea/cm2

≤3000 ea/cm2

N / A

TSD

≤500 ea/cm2

≤1000 ea/cm2

N / A

Qualità anteriore

Davanti

Si

Finitura superficiale

Si-Face CMP

Particelle

≤60ea/wafer (dimensione≥0,3μm)

N / A

Graffi

≤5ea/mm. Lunghezza cumulativa ≤Diameter

Diametro cumulativo della lunghezza ≤2*

N / A

Buccia/pozzi/macchie/striature/crepe/contaminazione

Nessuno

N / A

Bordo chips/riendi/frattura/piastre esadecimale

Nessuno

Aree politepi

Nessuno

Area cumulativa≤20%

Area cumulativa≤30%

Marcatura laser anteriore

Nessuno

Qualità alla schiena

Finitura posteriore

C-FACE CMP

Graffi

≤5ea/mm, lunghezza cumulativa≤2*diametro

N / A

Difetti posteriori (bordo chip/rientri)

Nessuno

Rugosità posteriore

RA≤0,2 nm (5μm*5μm)

Marcatura laser sul retro

1 mm (dal bordo superiore)

Bordo

Bordo

Smussare

Confezione

Confezione

Prepasto EPI con imballaggio a vuoto

Packaging a cassette multi-wafer

*Note : “NA” significa che nessuna richiesta di richiesta non menzionata può fare riferimento a semi-std.

tech_1_2_size

Sic Wafer

Newletter

In attesa del tuo contatto con noi