PFA Cassette– Experience unmatched chemical resistance and durability with Semicera’s PFA Cassette, the ideal solution for safe and efficient wafer handling in semiconductor manufacturing.
Semicera is pleased to offer the PFA Cassette, a premium choice for wafer handling in environments where chemical resistance and durability are paramount. Crafted from high-purity Perfluoroalkoxy (PFA) material, this cassette is designed to withstand the most demanding conditions in semiconductor fabrication, ensuring the safety and integrity of your wafers.
Unmatched Chemical Resistance IL PFA Cassette is engineered to provide superior resistance to a wide range of chemicals, making it the perfect choice for processes that involve aggressive acids, solvents, and other harsh chemicals. This robust chemical resistance ensures that the cassette remains intact and functional even in the most corrosive environments, thereby extending its lifespan and reducing the need for frequent replacements.
High-Purity Construction Semicera’s PFA Cassette is manufactured from ultra-pure PFA material, which is critical in preventing contamination during wafer processing. This high-purity construction minimizes the risk of particle generation and chemical leaching, ensuring that your wafers are protected from impurities that could compromise their quality.
Enhanced Durability and Performance Designed for durability, the PFA Cassette maintains its structural integrity under extreme temperatures and rigorous processing conditions. Whether exposed to high temperatures or subjected to repeated handling, this cassette retains its shape and performance, offering long-term reliability in demanding manufacturing environments.
Precision Engineering for Secure Handling IL Semicera PFA Cassette features precise engineering that ensures secure and stable wafer handling. Each slot is carefully designed to hold wafers securely in place, preventing any movement or shifting that could result in damage. This precision engineering supports consistent and accurate wafer placement, contributing to overall process efficiency.
Versatile Application Across Processes Thanks to its superior material properties, the PFA Cassette is versatile enough to be used across various stages of semiconductor fabrication. It is particularly well-suited for wet etching, chemical vapor deposition (CVD), and other processes that involve harsh chemical environments. Its adaptability makes it an essential tool in maintaining process integrity and wafer quality.
Commitment to Quality and Innovation At Semicera, we are committed to providing products that meet the highest industry standards. The PFA Cassette exemplifies this commitment, offering a reliable solution that integrates seamlessly into your manufacturing processes. Each cassette undergoes strict quality control to ensure it meets our rigorous performance criteria, delivering the excellence you expect from Semicera.
Elementi |
Produzione |
Ricerca |
Manichino |
Parametri cristallini |
|||
Politipo |
4H |
||
Errore di orientamento della superficie |
4±0.15° |
||
Parametri elettrici |
|||
Drogante |
azoto di tipo n |
||
Resistività |
0,015-0,025ohm · cm |
||
Parametri meccanici |
|||
Diametro |
150,0 ± 0,2 mm |
||
Spessore |
350 ± 25 µm |
||
Orientamento piatto primario |
[1-100]±5° |
||
Lunghezza piatta primaria |
47,5 ± 1,5 mm |
||
Piatto secondario |
Nessuno |
||
TTV |
≤5 µm |
≤10 µm |
≤15 µm |
LTV |
≤3 μm (5mm*5mm) |
≤5 μm (5 mm*5 mm) |
≤10 μm (5 mm*5 mm) |
Arco |
-15μm ~ 15μm |
-35μm ~ 35 μm |
-45μm ~ 45μm |
Ordito |
≤35 µm |
≤45 µm |
≤55 µm |
Front (Si-Face) Rughess (AFM) |
RA≤0,2 nm (5μm*5μm) |
||
Struttura |
|||
Densità di micrivipe |
<1 ea/cm2 |
<10 ea/cm2 |
<15 ea/cm2 |
Impurità dei metalli |
≤5E10atoms/cm2 |
N / A |
|
BPD |
≤1500 ea/cm2 |
≤3000 ea/cm2 |
N / A |
TSD |
≤500 ea/cm2 |
≤1000 ea/cm2 |
N / A |
Qualità anteriore |
|||
Davanti |
Si |
||
Finitura superficiale |
Si-Face CMP |
||
Particelle |
≤60ea/wafer (dimensione≥0,3μm) |
N / A |
|
Graffi |
≤5ea/mm. Lunghezza cumulativa ≤Diameter |
Diametro cumulativo della lunghezza ≤2* |
N / A |
Buccia/pozzi/macchie/striature/crepe/contaminazione |
Nessuno |
N / A |
|
Bordo chips/riendi/frattura/piastre esadecimale |
Nessuno |
||
Aree politepi |
Nessuno |
Area cumulativa≤20% |
Area cumulativa≤30% |
Marcatura laser anteriore |
Nessuno |
||
Qualità alla schiena |
|||
Finitura posteriore |
C-FACE CMP |
||
Graffi |
≤5ea/mm, lunghezza cumulativa≤2*diametro |
N / A |
|
Difetti posteriori (bordo chip/rientri) |
Nessuno |
||
Rugosità posteriore |
RA≤0,2 nm (5μm*5μm) |
||
Marcatura laser sul retro |
1 mm (dal bordo superiore) |
||
Bordo |
|||
Bordo |
Smussare |
||
Confezione |
|||
Confezione |
Prepasto EPI con imballaggio a vuoto Packaging a cassette multi-wafer |
||
*Note : “NA” significa che nessuna richiesta di richiesta non menzionata può fare riferimento a semi-std. |