Silicon Wafer

Semicera Silicon Wafers are the cornerstone of modern semiconductor devices, offering unmatched purity and precision. Designed to meet the stringent demands of high-tech industries, these wafers ensure reliable performance and consistent quality. Trust Semicera for your cutting-edge electronic applications and innovative technology solutions.

Semicera Silicon Wafers are meticulously crafted to serve as the foundation for a wide array of semiconductor devices, from microprocessors to photovoltaic cells. These wafers are engineered with high precision and purity, ensuring optimal performance in various electronic applications.

Manufactured using advanced techniques, Semicera Silicon Wafers exhibit exceptional flatness and uniformity, which are crucial for achieving high yields in semiconductor fabrication. This level of precision helps in minimizing defects and improving the overall efficiency of electronic components.

The superior quality of Semicera Silicon Wafers is evident in their electrical characteristics, which contribute to the enhanced performance of semiconductor devices. With low impurity levels and high crystal quality, these wafers provide the ideal platform for developing high-performance electronics.

Available in various sizes and specifications, Semicera Silicon Wafers can be tailored to meet the specific needs of different industries, including computing, telecommunications, and renewable energy. Whether for large-scale manufacturing or specialized research, these wafers deliver reliable results.

Semicera is committed to supporting the growth and innovation of the semiconductor industry by providing high-quality silicon wafers that meet the highest industry standards. With a focus on precision and reliability, Semicera enables manufacturers to push the boundaries of technology, ensuring their products stay at the forefront of the market.

Elementi

Produzione

Ricerca

Manichino

Parametri cristallini

Politipo

4H

Errore di orientamento della superficie

4±0.15°

Parametri elettrici

Drogante

azoto di tipo n

Resistività

0,015-0,025ohm · cm

Parametri meccanici

Diametro

150,0 ± 0,2 mm

Spessore

350 ± 25 µm

Orientamento piatto primario

[1-100]±5°

Lunghezza piatta primaria

47,5 ± 1,5 mm

Piatto secondario

Nessuno

TTV

≤5 µm

≤10 µm

≤15 µm

LTV

≤3 μm (5mm*5mm)

≤5 μm (5 mm*5 mm)

≤10 μm (5 mm*5 mm)

Arco

-15μm ~ 15μm

-35μm ~ 35 μm

-45μm ~ 45μm

Ordito

≤35 µm

≤45 µm

≤55 µm

Front (Si-Face) Rughess (AFM)

RA≤0,2 nm (5μm*5μm)

Struttura

Densità di micrivipe

<1 ea/cm2

<10 ea/cm2

<15 ea/cm2

Impurità dei metalli

≤5E10atoms/cm2

N / A

BPD

≤1500 ea/cm2

≤3000 ea/cm2

N / A

TSD

≤500 ea/cm2

≤1000 ea/cm2

N / A

Qualità anteriore

Davanti

Si

Finitura superficiale

Si-Face CMP

Particelle

≤60ea/wafer (dimensione≥0,3μm)

N / A

Graffi

≤5ea/mm. Lunghezza cumulativa ≤Diameter

Diametro cumulativo della lunghezza ≤2*

N / A

Buccia/pozzi/macchie/striature/crepe/contaminazione

Nessuno

N / A

Bordo chips/riendi/frattura/piastre esadecimale

Nessuno

Aree politepi

Nessuno

Area cumulativa≤20%

Area cumulativa≤30%

Marcatura laser anteriore

Nessuno

Qualità alla schiena

Finitura posteriore

C-FACE CMP

Graffi

≤5ea/mm, lunghezza cumulativa≤2*diametro

N / A

Difetti posteriori (bordo chip/rientri)

Nessuno

Rugosità posteriore

RA≤0,2 nm (5μm*5μm)

Marcatura laser sul retro

1 mm (dal bordo superiore)

Bordo

Bordo

Smussare

Confezione

Confezione

Prepasto EPI con imballaggio a vuoto

Packaging a cassette multi-wafer

*Note : “NA” significa che nessuna richiesta di richiesta non menzionata può fare riferimento a semi-std.

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Sic Wafer

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