Wafer Carriers– Secure and efficient wafer handling solutions by Semicera, designed to protect and transport semiconductor wafers with utmost precision and reliability in advanced manufacturing environments.
Semicera presents the industry-leading Wafer Carriers, engineered to provide superior protection and seamless transportation of delicate semiconductor wafers across various stages of the manufacturing process. Our Wafer Carriers are meticulously designed to meet the stringent demands of modern semiconductor fabrication, ensuring the integrity and quality of your wafers are maintained at all times.
Caratteristiche chiave:
• Premium Material Construction: Crafted from high-quality, contamination-resistant materials that guarantee durability and longevity, making them ideal for cleanroom environments.
• Precision Design: Features precise slot alignment and secure holding mechanisms to prevent wafer slippage and damage during handling and transportation.
• Versatile Compatibility: Accommodates a wide range of wafer sizes and thicknesses, providing flexibility for various semiconductor applications.
• Ergonomic Handling: Lightweight and user-friendly design facilitates easy loading and unloading, enhancing operational efficiency and reducing handling time.
• Customizable Options: Offers customization to meet specific requirements, including material choice, size adjustments, and labeling for optimized workflow integration.
Enhance your semiconductor manufacturing process with Semicera’s Wafer Carriers, the perfect solution for safeguarding your wafers against contamination and mechanical damage. Trust in our commitment to quality and innovation to deliver products that not only meet but exceed industry standards, ensuring your operations run smoothly and efficiently.
|
Elementi |
Produzione |
Ricerca |
Manichino |
|
Parametri cristallini |
|||
|
Politipo |
4H |
||
|
Errore di orientamento della superficie |
4±0.15° |
||
|
Parametri elettrici |
|||
|
Drogante |
azoto di tipo n |
||
|
Resistività |
0,015-0,025ohm · cm |
||
|
Parametri meccanici |
|||
|
Diametro |
150,0 ± 0,2 mm |
||
|
Spessore |
350 ± 25 µm |
||
|
Orientamento piatto primario |
[1-100]±5° |
||
|
Lunghezza piatta primaria |
47,5 ± 1,5 mm |
||
|
Piatto secondario |
Nessuno |
||
|
TTV |
≤5 µm |
≤10 µm |
≤15 µm |
|
LTV |
≤3 μm (5mm*5mm) |
≤5 μm (5 mm*5 mm) |
≤10 μm (5 mm*5 mm) |
|
Arco |
-15μm ~ 15μm |
-35μm ~ 35 μm |
-45μm ~ 45μm |
|
Ordito |
≤35 µm |
≤45 µm |
≤55 µm |
|
Front (Si-Face) Rughess (AFM) |
RA≤0,2 nm (5μm*5μm) |
||
|
Struttura |
|||
|
Densità di micrivipe |
<1 ea/cm2 |
<10 ea/cm2 |
<15 ea/cm2 |
|
Impurità dei metalli |
≤5E10atoms/cm2 |
N / A |
|
|
BPD |
≤1500 ea/cm2 |
≤3000 ea/cm2 |
N / A |
|
TSD |
≤500 ea/cm2 |
≤1000 ea/cm2 |
N / A |
|
Qualità anteriore |
|||
|
Davanti |
Si |
||
|
Finitura superficiale |
Si-Face CMP |
||
|
Particelle |
≤60ea/wafer (dimensione≥0,3μm) |
N / A |
|
|
Graffi |
≤5ea/mm. Lunghezza cumulativa ≤Diameter |
Diametro cumulativo della lunghezza ≤2* |
N / A |
|
Buccia/pozzi/macchie/striature/crepe/contaminazione |
Nessuno |
N / A |
|
|
Bordo chips/riendi/frattura/piastre esadecimale |
Nessuno |
||
|
Aree politepi |
Nessuno |
Area cumulativa≤20% |
Area cumulativa≤30% |
|
Marcatura laser anteriore |
Nessuno |
||
|
Qualità alla schiena |
|||
|
Finitura posteriore |
C-FACE CMP |
||
|
Graffi |
≤5ea/mm, lunghezza cumulativa≤2*diametro |
N / A |
|
|
Difetti posteriori (bordo chip/rientri) |
Nessuno |
||
|
Rugosità posteriore |
RA≤0,2 nm (5μm*5μm) |
||
|
Marcatura laser sul retro |
1 mm (dal bordo superiore) |
||
|
Bordo |
|||
|
Bordo |
Smussare |
||
|
Confezione |
|||
|
Confezione |
Prepasto EPI con imballaggio a vuoto Packaging a cassette multi-wafer |
||
|
*Note ： “NA” significa che nessuna richiesta di richiesta non menzionata può fare riferimento a semi-std. |
|||
