{"id":5676,"date":"2026-05-18T12:07:09","date_gmt":"2026-05-18T04:07:09","guid":{"rendered":"https:\/\/www.cn-semiconductorparts.com\/why-are-there-small-holes-on-the-cfc-external-diversion-tube\/"},"modified":"2026-05-18T12:07:09","modified_gmt":"2026-05-18T04:07:09","slug":"why-are-there-small-holes-on-the-cfc-external-diversion-tube","status":"publish","type":"post","link":"https:\/\/www.cn-semiconductorparts.com\/it\/why-are-there-small-holes-on-the-cfc-external-diversion-tube\/","title":{"rendered":"Why are there small holes on the CFC external diversion tube?"},"content":{"rendered":"<h1 align=\"center\" style=\"text-align: center;\"><span style=\"font-size: 36px; color: #1182cc;\"><b style=\"mso-bidi-font-weight: normal;\"><span style=\"font-family: 'Times New Roman';\">Why are there small holes on the CFC external diversion tube?<\/span><\/b><\/span><b style=\"mso-bidi-font-weight: normal;\"><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; mso-ansi-font-weight: bold; font-size: 22.0000pt; mso-font-kerning: 22.0000pt;\"><o:p><\/o:p><\/span><\/b><\/h1>\n<p class=\"p\" align=\"justify\" style=\"margin-left: 0.0000pt; text-indent: 0.0000pt; text-autospace: ideograph-numeric; mso-pagination: widow-orphan; text-align: justify; text-justify: inter-ideograph; vertical-align: middle;\"><span style=\"font-family: 'Times New Roman'; color: #333333; letter-spacing: 0pt; text-transform: none; font-style: normal; font-size: 16px; background: #ffffff;\">By Lucy (Sales) @ semicera semiconductor technology co., ltd.<\/span><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; color: #333333; letter-spacing: 0.0000pt; text-transform: none; font-style: normal; font-size: 12.0000pt; mso-font-kerning: 0.0000pt; background: #ffffff; mso-shading: #ffffff;\"><o:p><\/o:p><\/span><\/p>\n<hr>\n<p class=\"MsoNormal\" style=\"text-align: justify;\"><span style=\"font-family: 'Times New Roman'; font-size: 16px;\">The CFC external deflector tube features a circular edge composed of flange edges and annular air holes. These air holes are not designed arbitrarily but are tailored to the thermal field structure, airflow control, and installation fixation requirements.<\/span><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; font-size: 12.0000pt; mso-font-kerning: 1.0000pt;\"><o:p><\/o:p><\/span><\/p>\n<p class=\"MsoNormal\"><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; font-size: 12.0000pt; mso-font-kerning: 1.0000pt;\"><o:p>\u00a0<\/o:p><\/span><\/p>\n<h2><span style=\"font-size: 24px; color: #1182cc;\"><b style=\"mso-bidi-font-weight: normal;\"><span style=\"font-family: 'Times New Roman';\">1. Airflow guidance effect<\/span><\/b><\/span><b style=\"mso-bidi-font-weight: normal;\"><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u9ed1\u4f53; mso-ansi-font-weight: bold; font-size: 16.0000pt; mso-font-kerning: 1.0000pt;\"><o:p><\/o:p><\/span><\/b><\/h2>\n<p class=\"MsoNormal\" align=\"justify\" style=\"mso-pagination: none; text-align: justify; text-justify: inter-ideograph;\"><span style=\"font-size: 16px;\"><span style=\"font-family: 'Times New Roman';\">Within the crystal growth furnace, high-temperature gases flow continuously. If the flow guide cylinder is completely sealed, the hot gases cannot exchange uniformly, and localized airflow stagnation may occur, leading to vortex formation and localized overheating. Therefore, flow channels must be established through the guide holes to maintain pressure equilibrium inside the furnace and ensure a stable heat transfer path.<\/span><span style=\"font-family: 'Times New Roman';\"><o:p><\/o:p><\/span><\/span><\/p>\n<p class=\"MsoNormal\" align=\"justify\" style=\"mso-pagination: none; text-align: justify; text-justify: inter-ideograph;\"><span style=\"font-family: 'Times New Roman'; font-size: 16px;\"><o:p>\u00a0<\/o:p><\/span><\/p>\n<p class=\"MsoNormal\" align=\"justify\" style=\"mso-pagination: none; text-align: justify; text-justify: inter-ideograph;\"><span style=\"font-family: 'Times New Roman'; font-size: 16px;\">Semicera enhances the uniformity of the furnace temperature field and reduces local temperature fluctuations by controlling the cross-sectional area of the airflow channels, thereby regulating gas flow velocity and direction. This improves crystal growth stability. Semicera understands that during crystal growth, temperature gradients and airflow stability directly influence defect formation, microtube density, and growth rate; thus, pore design is critical. Semicera customizes distinct pore configurations based on customer requirements and operational conditions to meet specific needs.<\/span><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; font-size: 12.0000pt; mso-font-kerning: 1.0000pt;\"><o:p><\/o:p><\/span><\/p>\n<p class=\"MsoNormal\" align=\"justify\" style=\"mso-pagination: none; text-align: justify; text-justify: inter-ideograph;\"><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; font-size: 12.0000pt; mso-font-kerning: 1.0000pt;\"><o:p>\u00a0<\/o:p><\/span><\/p>\n<h2><span style=\"font-size: 24px; color: #1182cc;\"><b style=\"mso-bidi-font-weight: normal;\"><span style=\"font-family: 'Times New Roman';\">2. Thermal stress<\/span><\/b><\/span><b style=\"mso-bidi-font-weight: normal;\"><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u9ed1\u4f53; mso-ansi-font-weight: bold; font-size: 16.0000pt; mso-font-kerning: 1.0000pt;\"><o:p><\/o:p><\/span><\/b><\/h2>\n<p class=\"MsoNormal\" align=\"justify\" style=\"mso-pagination: none; text-align: justify; text-justify: inter-ideograph;\"><span style=\"font-size: 16px;\"><span style=\"font-family: 'Times New Roman';\">As is well known, CFC materials exhibit a low coefficient of thermal expansion, excellent thermal shock resistance, and good high-temperature stability. However, at temperatures above 2000\u00b0C, temperature gradient stresses and structural stress concentrations still occur. Moreover, the flow guide cylinder features a large-sized thin-walled structure that must withstand prolonged high-temperature cycling operations. If entirely pore-free, thermal stresses will concentrate, leading to edge cracking and eventual deformation with extended use.<\/span><span style=\"font-family: 'Times New Roman';\"><o:p><\/o:p><\/span><\/span><\/p>\n<p class=\"MsoNormal\" align=\"justify\" style=\"mso-pagination: none; text-align: justify; text-justify: inter-ideograph;\"><span style=\"font-family: 'Times New Roman'; font-size: 16px;\"><\/span><\/p>\n<p class=\"MsoNormal\" align=\"justify\" style=\"mso-pagination: none; text-align: justify; text-justify: inter-ideograph;\"><span style=\"font-size: 16px;\"><span style=\"font-family: 'Times New Roman';\">Therefore, by designing the release openings, Semicera can <strong>interrupt the stress transmission path and distribute local thermal stresses<\/strong>, thereby extending the structural service life. The design of Semicera incorporates finite element thermal stress analysis (FEA), thermal field simulations, and actual furnace cycle life data to determine the aperture size and positioning.<\/span><span style=\"font-family: 'Times New Roman';\"><o:p><\/o:p><\/span><\/span><\/p>\n<p class=\"MsoNormal\" align=\"justify\" style=\"mso-pagination: none; text-align: justify; text-justify: inter-ideograph;\"><span style=\"font-family: 'Times New Roman'; font-size: 16px;\"><o:p>\u00a0<\/o:p><img fetchpriority=\"high\" decoding=\"async\" src=\"https:\/\/www.cn-semiconductorparts.com\/wp-content\/uploads\/2026\/05\/CFC.webp\" alt=\"\" width=\"1151\" height=\"767\"><\/span><\/p>\n<h2 style=\"mso-list: l0 level1 lfo1;\"><!-- [if !supportLists]--><span style=\"font-size: 24px; color: #1182cc;\"><span style=\"font-family: 'Times New Roman';\"><span style=\"mso-list: Ignore;\">3.\u00a0<\/span><\/span><!--[endif]--><b style=\"mso-bidi-font-weight: normal;\"><span style=\"font-family: 'Times New Roman';\">Temperature Field Regulation<\/span><\/b><\/span><b style=\"mso-bidi-font-weight: normal;\"><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u9ed1\u4f53; mso-ansi-font-weight: bold; font-size: 16.0000pt; mso-font-kerning: 1.0000pt;\"><o:p><\/o:p><\/span><\/b><\/h2>\n<p class=\"MsoNormal\" align=\"justify\" style=\"mso-pagination: none; text-align: justify; text-justify: inter-ideograph;\"><span style=\"font-size: 16px;\"><span style=\"font-family: 'Times New Roman';\">The external deflector tube itself also serves as a thermal radiation regulation component, while CFC is a high-temperature radiation material. The aperture ratio in different regions affects the thermal radiation exchange efficiency. In other words, a higher number of openings leads to faster local heat dissipation and a relative temperature reduction, whereas fewer openings provide better thermal insulation and more concentrated heat distribution.<\/span><span style=\"font-family: 'Times New Roman';\"><o:p><\/o:p><\/span><\/span><\/p>\n<p class=\"MsoNormal\" align=\"justify\" style=\"mso-pagination: none; text-align: justify; text-justify: inter-ideograph;\"><span style=\"font-family: 'Times New Roman'; font-size: 16px;\"><o:p>\u00a0<\/o:p><\/span><\/p>\n<p class=\"MsoNormal\" align=\"justify\" style=\"mso-pagination: none; text-align: justify; text-justify: inter-ideograph;\"><span style=\"font-family: 'Times New Roman'; font-size: 16px;\">Semicera adjusts the <strong>number, distribution, symmetry, and aperture ratio of pores based on crystal size, growth method, and heating configuration<\/strong> to achieve optimal thermal field performance.<\/span><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; font-size: 12.0000pt; mso-font-kerning: 1.0000pt;\"><o:p><\/o:p><\/span><\/p>\n<p class=\"MsoNormal\" align=\"justify\" style=\"mso-pagination: none; text-align: justify; text-justify: inter-ideograph;\"><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; font-size: 12.0000pt; mso-font-kerning: 1.0000pt;\"><o:p>\u00a0<\/o:p><\/span><\/p>\n<h2 style=\"mso-list: l0 level1 lfo1;\"><!-- [if !supportLists]--><span style=\"color: #1182cc; font-size: 24px;\"><span style=\"font-family: 'Times New Roman';\"><span style=\"mso-list: Ignore;\">4.\u00a0<\/span><\/span><!--[endif]--><b style=\"mso-bidi-font-weight: normal;\"><span style=\"font-family: 'Times New Roman';\">Installation Positioning and Structural Fixation<\/span><\/b><b style=\"mso-bidi-font-weight: normal;\"><span style=\"font-family: 'Times New Roman';\"><o:p><\/o:p><\/span><\/b><span style=\"font-family: 'Times New Roman';\"><o:p>\u00a0<\/o:p><\/span><\/span><\/h2>\n<p class=\"MsoNormal\" align=\"justify\" style=\"mso-pagination: none; text-align: justify; text-justify: inter-ideograph;\"><span style=\"font-family: 'Times New Roman'; font-size: 16px;\">Certain holes also serve for installation and fixation, coaxial positioning, and thermal field assembly. Given the numerous layers of thermal field components within the crystal growth furnace, the stringent coaxial precision requirements, and the complexity of thermal expansion compensation, precise assembly must be achieved through these hole positions.<\/span><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; font-size: 12.0000pt; mso-font-kerning: 1.0000pt;\"><o:p><\/o:p><\/span><\/p>\n<p class=\"MsoNormal\" align=\"justify\" style=\"mso-pagination: none; text-align: justify; text-justify: inter-ideograph;\"><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; font-size: 12.0000pt; mso-font-kerning: 1.0000pt;\"><o:p>\u00a0<\/o:p><\/span><\/p>\n<h2><span style=\"font-size: 24px; color: #1182cc;\"><b style=\"mso-bidi-font-weight: normal;\"><span style=\"font-family: 'Times New Roman';\">Why are CFCs more suitable for this structure?<\/span><\/b><\/span><b style=\"mso-bidi-font-weight: normal;\"><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u9ed1\u4f53; mso-ansi-font-weight: bold; font-size: 16.0000pt; mso-font-kerning: 1.0000pt;\"><o:p><\/o:p><\/span><\/b><\/h2>\n<p class=\"MsoNormal\"><span style=\"font-family: 'Times New Roman'; font-size: 16px;\">Compared to traditional graphite, CFC exhibits higher mechanical strength, lower thermal expansion, superior thermal shock resistance, and a longer service life. Consequently, even after timely perforation processing, it maintains high structural stability.<\/span><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; font-size: 12.0000pt; mso-font-kerning: 1.0000pt;\"><o:p><\/o:p><\/span><\/p>\n<p class=\"MsoNormal\"><span style=\"font-family: 'Times New Roman'; font-size: 16px;\"><\/span><\/p>\n<h2 class=\"MsoNormal\"><span style=\"font-family: 'Times New Roman'; font-size: 24px; color: #1182cc;\">Semicera&#8217;s CFC \u00a0<span style=\"font-family: 'Times New Roman';\">external diversion tube<\/span><\/span><\/h2>\n<p class=\"p\" style=\"text-align: justify;\"><span style=\"font-size: 16px;\"><span style=\"font-family: 'Times New Roman';\">Semicera adopts a combined densification process of <span style=\"color: #e03e2d;\"><strong>chemical vapor deposition (CVD) and liquid-phase impregnation<\/strong><\/span>, effectively solving the issue of uneven density commonly found in pure CVD processes. At the same time, high-purity and high-performance resin impregnation is utilized to achieve higher densification efficiency, shorter production cycles, and longer product service life.<\/span><span style=\"font-family: 'Times New Roman';\"><o:p><\/o:p><\/span><\/span><\/p>\n<p class=\"p\" style=\"text-align: justify;\"><span style=\"font-size: 16px;\"><span style=\"font-family: 'Times New Roman';\"><\/span><\/span><\/p>\n<p class=\"p\" style=\"text-align: justify;\"><span style=\"font-family: 'Times New Roman'; font-size: 16px;\">In addition, through optimized microstructure design, the product features low porosity at R-angle areas, excellent corrosion resistance, and minimal particle shedding, ensuring the purity of silicon materials during operation.<\/span><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; font-size: 12.0000pt; mso-font-kerning: 0.0000pt;\"><o:p><\/o:p><\/span><\/p>\n<p class=\"p\" style=\"text-align: justify;\"><span style=\"font-family: 'Times New Roman'; font-size: 16px;\"><img decoding=\"async\" src=\"https:\/\/www.cn-semiconductorparts.com\/wp-content\/uploads\/2026\/05\/WPS\u56fe\u7247-1f131683a90c.webp\" alt=\"\"><\/span><\/p>\n<h3 class=\"p\"><b style=\"mso-bidi-font-weight: normal;\"><span class=\"15\" style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; mso-ansi-font-weight: bold;\">Semicera Specifications:<\/span><\/b><\/h3>\n<p class=\"p\" style=\"mso-pagination: widow-orphan;\"><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; font-size: 12.0000pt; mso-font-kerning: 0.0000pt;\"><o:p><\/o:p><\/span><!-- [if !supportLists]--><span style=\"color: #e03e2d;\"><span style=\"font-family: Symbol; mso-fareast-font-family: \u5b8b\u4f53; font-size: 10.0000pt; mso-font-kerning: 1.0000pt;\"><span style=\"mso-list: Ignore;\">\u00b7<span style=\"font: 7.0pt Times New Roman;\"> <\/span><\/span><\/span><!--[endif]--><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; font-size: 10.5000pt; mso-font-kerning: 1.0000pt;\"><o:p><\/o:p><\/span><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; font-size: 12.0000pt; mso-font-kerning: 0.0000pt;\">Density: 1.30\u20131.35 g\/cm\u00b3<\/span><\/span><\/p>\n<p class=\"p\" style=\"mso-pagination: widow-orphan;\"><span style=\"color: #e03e2d;\"><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; font-size: 12.0000pt; mso-font-kerning: 0.0000pt;\"><o:p><\/o:p><\/span><!-- [if !supportLists]--><span style=\"font-family: Symbol; mso-fareast-font-family: \u5b8b\u4f53; font-size: 10.0000pt; mso-font-kerning: 1.0000pt;\"><span style=\"mso-list: Ignore;\">\u00b7<span style=\"font: 7.0pt Times New Roman;\"> <\/span><\/span><\/span><!--[endif]--><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; font-size: 10.5000pt; mso-font-kerning: 1.0000pt;\"><o:p><\/o:p><\/span><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; font-size: 12.0000pt; mso-font-kerning: 0.0000pt;\">Service Life: 10\u201314 months<\/span><\/span><span style=\"mso-spacerun: 'yes'; font-family: 'Times New Roman'; mso-fareast-font-family: \u5b8b\u4f53; font-size: 12.0000pt; mso-font-kerning: 0.0000pt;\"><o:p><\/o:p><\/span><\/p>","protected":false},"excerpt":{"rendered":"<p class=\"MsoNormal\" style=\"text-align: justify;\"><span style=\"font-size: 16px;\"><span style=\"font-family: 'Times New Roman';\">The CFC external deflector tube features a circular edge composed of flange edges and annular air holes. These air holes are not designed arbitrarily but are tailored to the thermal field structure, airflow control, and installation fixation requirements.<\/span><span style=\"font-family: 'Times New Roman';\">\u00a0<\/span><\/span><\/p>","protected":false},"author":1,"featured_media":5672,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"cdn_img":"","footnotes":""},"categories":[1],"tags":[107],"class_list":["post-5676","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-uncategorized","tag-cfc"],"_links":{"self":[{"href":"https:\/\/www.cn-semiconductorparts.com\/it\/wp-json\/wp\/v2\/posts\/5676","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.cn-semiconductorparts.com\/it\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.cn-semiconductorparts.com\/it\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/it\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/it\/wp-json\/wp\/v2\/comments?post=5676"}],"version-history":[{"count":0,"href":"https:\/\/www.cn-semiconductorparts.com\/it\/wp-json\/wp\/v2\/posts\/5676\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/it\/wp-json\/wp\/v2\/media\/5672"}],"wp:attachment":[{"href":"https:\/\/www.cn-semiconductorparts.com\/it\/wp-json\/wp\/v2\/media?parent=5676"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/it\/wp-json\/wp\/v2\/categories?post=5676"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/it\/wp-json\/wp\/v2\/tags?post=5676"}],"curies":[{"name":"WP","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}