4 Inch N-type SiC Substrate

Semicera’s 4 Inch N-type SiC Substrates are meticulously designed for superior electrical and thermal performance in power electronics and high-frequency applications. These substrates offer excellent conductivity and stability, making them ideal for next-generation semiconductor devices. Trust Semicera for precision and quality in advanced materials.

Semicera’s 4 Inch N-type SiC Substrates are crafted to meet the exacting standards of the semiconductor industry. These substrates provide a high-performance foundation for a wide range of electronic applications, offering exceptional conductivity and thermal properties.

The N-type doping of these SiC substrates enhances their electrical conductivity, making them particularly suitable for high-power and high-frequency applications. This property allows for the efficient operation of devices such as diodes, transistors, and amplifiers, where minimizing energy loss is crucial.

Semicera utilizes state-of-the-art manufacturing processes to ensure that each substrate exhibits excellent surface quality and uniformity. This precision is critical for applications in power electronics, microwave devices, and other technologies that demand reliable performance under extreme conditions.

Incorporating Semicera’s N-type SiC substrates into your production line means benefiting from materials that offer superior heat dissipation and electrical stability. These substrates are ideal for creating components that require durability and efficiency, such as power conversion systems and RF amplifiers.

By choosing Semicera’s 4 Inch N-type SiC Substrates, you are investing in a product that combines innovative material science with meticulous craftsmanship. Semicera continues to lead the industry by providing solutions that support the development of cutting-edge semiconductor technologies, ensuring high performance and reliability.

항목

생산

연구

더미

결정 매개 변수

폴리 타입

4H

표면 방향 오류

4±0.15°

전기 매개 변수

도펀트

N- 타입 질소

저항

0.015-0.025ohm · cm

기계적 매개 변수

지름

150.0 ± 0.2mm

두께

350 ± 25 µm

1 차 평평한 방향

[1-100]±5°

1 차 평평한 길이

47.5 ± 1.5mm

보조 아파트

없음

TTV

≤5 µm

≤10 µm

≤15 µm

LTV

≤3 μm (5mm*5mm)

≤5 μm (5mm*5mm)

≤10 μm (5mm*5mm)

절하다

-15μm ~ 15μm

-35μm ~ 35μm

-45μm ~ 45μm

경사

≤35 µm

≤45 µm

≤55 µm

전면 (si-face) 거칠기 (AFM)

Ra≤0.2nm (5μm*5μm)

구조

마이크로 파이프 밀도

<1 EA/CM2

<10 EA/CM2

<15 EA/CM2

금속 불순물

≤5E10atoms/cm2

NA

BPD

≤1500 EA/CM2

≤3000 EA/CM2

NA

TSD

≤500 EA/CM2

≤1000 EA/CM2

NA

프론트 품질

앞쪽

표면 마감

Si-Face CMP

입자

≤60EA/웨이퍼 (크기 0.3μm)

NA

흠집

≤5EA/mm. 누적 길이 ≤ diameter

누적 길이 ≤2*직경

NA

오렌지 껍질/구덩이/얼룩/줄무늬/균열/오염

없음

NA

에지 칩/인테이션/골절/육각 플레이트

없음

폴리 타입 영역

없음

누적 면적 ≤20%

누적 면적 ≤30%

전면 레이저 표시

없음

뒤로 품질

뒤로 마무리

C-Face CMP

흠집

≤5EA/mm, 누적 길이 ≤2*직경

NA

등 결함 (Edge Chips/Indents)

없음

뒤로 거칠기

Ra≤0.2nm (5μm*5μm)

뒤 레이저 표시

1 mm (상단 가장자리에서)

가장자리

가장자리

모따기

포장

포장

진공 포장으로 에피 레디

멀티 웨이 커 카세트 포장

*참고 :“NA”는 언급되지 않은 요청 항목이 Semi-STD를 참조 할 수 없음을 의미합니다.

tech_1_2_size

sic wafers

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