Si Epitaxy– Achieve superior device performance with Semicera’s Si Epitaxy, offering precision-grown silicon layers for advanced semiconductor applications.
세미카 introduces its high-quality si 에피 탁시 services, designed to meet the exacting standards of today’s semiconductor industry. Epitaxial silicon layers are critical for the performance and reliability of electronic devices, and our Si Epitaxy solutions ensure that your components achieve optimal functionality.
Precision-Grown Silicon Layers 세미카 understands that the foundation of high-performance devices lies in the quality of the materials used. Our si 에피 탁시 process is meticulously controlled to produce silicon layers with exceptional uniformity and crystal integrity. These layers are essential for applications ranging from microelectronics to advanced power devices, where consistency and reliability are paramount.
Optimized for Device Performance 그만큼 si 에피 탁시 services offered by Semicera are tailored to enhance the electrical properties of your devices. By growing high-purity silicon layers with low defect densities, we ensure that your components perform at their best, with improved carrier mobility and minimized electrical resistivity. This optimization is critical for achieving the high-speed and high-efficiency characteristics demanded by modern technology.
Versatility in Applications 세미카’s si 에피 탁시 is suitable for a wide range of applications, including the production of CMOS transistors, power MOSFETs, and bipolar junction transistors. Our flexible process allows for customization based on the specific requirements of your project, whether you need thin layers for high-frequency applications or thicker layers for power devices.
Superior Material Quality Quality is at the heart of everything we do at Semicera. Our si 에피 탁시 process uses state-of-the-art equipment and techniques to ensure that each silicon layer meets the highest standards of purity and structural integrity. This attention to detail minimizes the occurrence of defects that could impact device performance, resulting in more reliable and longer-lasting components.
Commitment to Innovation 세미카 is committed to staying at the forefront of semiconductor technology. Our si 에피 탁시 services reflect this commitment, incorporating the latest advancements in epitaxial growth techniques. We continuously refine our processes to deliver silicon layers that meet the evolving needs of the industry, ensuring that your products remain competitive in the market.
Tailored Solutions for Your Needs Understanding that every project is unique, 세미카 offers customized si 에피 탁시 solutions to match your specific needs. Whether you require particular doping profiles, layer thicknesses, or surface finishes, our team works closely with you to deliver a product that meets your precise specifications.
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항목 |
생산 |
연구 |
더미 |
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결정 매개 변수 |
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폴리 타입 |
4H |
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표면 방향 오류 |
4±0.15° |
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전기 매개 변수 |
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도펀트 |
N- 타입 질소 |
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저항 |
0.015-0.025ohm · cm |
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기계적 매개 변수 |
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지름 |
150.0 ± 0.2mm |
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두께 |
350 ± 25 µm |
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1 차 평평한 방향 |
[1-100]±5° |
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1 차 평평한 길이 |
47.5 ± 1.5mm |
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보조 아파트 |
없음 |
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TTV |
≤5 µm |
≤10 µm |
≤15 µm |
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LTV |
≤3 μm (5mm*5mm) |
≤5 μm (5mm*5mm) |
≤10 μm (5mm*5mm) |
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절하다 |
-15μm ~ 15μm |
-35μm ~ 35μm |
-45μm ~ 45μm |
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경사 |
≤35 µm |
≤45 µm |
≤55 µm |
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전면 (si-face) 거칠기 (AFM) |
Ra≤0.2nm (5μm*5μm) |
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구조 |
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마이크로 파이프 밀도 |
<1 EA/CM2 |
<10 EA/CM2 |
<15 EA/CM2 |
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금속 불순물 |
≤5E10atoms/cm2 |
NA |
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BPD |
≤1500 EA/CM2 |
≤3000 EA/CM2 |
NA |
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TSD |
≤500 EA/CM2 |
≤1000 EA/CM2 |
NA |
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프론트 품질 |
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앞쪽 |
시 |
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표면 마감 |
Si-Face CMP |
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입자 |
≤60EA/웨이퍼 (크기 0.3μm) |
NA |
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흠집 |
≤5EA/mm. 누적 길이 ≤ diameter |
누적 길이 ≤2*직경 |
NA |
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오렌지 껍질/구덩이/얼룩/줄무늬/균열/오염 |
없음 |
NA |
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에지 칩/인테이션/골절/육각 플레이트 |
없음 |
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폴리 타입 영역 |
없음 |
누적 면적 ≤20% |
누적 면적 ≤30% |
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전면 레이저 표시 |
없음 |
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뒤로 품질 |
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뒤로 마무리 |
C-Face CMP |
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흠집 |
≤5EA/mm, 누적 길이 ≤2*직경 |
NA |
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등 결함 (Edge Chips/Indents) |
없음 |
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뒤로 거칠기 |
Ra≤0.2nm (5μm*5μm) |
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뒤 레이저 표시 |
1 mm (상단 가장자리에서) |
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가장자리 |
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가장자리 |
모따기 |
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포장 |
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포장 |
진공 포장으로 에피 레디 멀티 웨이 커 카세트 포장 |
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*참고 :“NA”는 언급되지 않은 요청 항목이 Semi-STD를 참조 할 수 없음을 의미합니다. |
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