Semicera Silicon Wafers are the cornerstone of modern semiconductor devices, offering unmatched purity and precision. Designed to meet the stringent demands of high-tech industries, these wafers ensure reliable performance and consistent quality. Trust Semicera for your cutting-edge electronic applications and innovative technology solutions.
Semicera Silicon Wafers are meticulously crafted to serve as the foundation for a wide array of semiconductor devices, from microprocessors to photovoltaic cells. These wafers are engineered with high precision and purity, ensuring optimal performance in various electronic applications.
Manufactured using advanced techniques, Semicera Silicon Wafers exhibit exceptional flatness and uniformity, which are crucial for achieving high yields in semiconductor fabrication. This level of precision helps in minimizing defects and improving the overall efficiency of electronic components.
The superior quality of Semicera Silicon Wafers is evident in their electrical characteristics, which contribute to the enhanced performance of semiconductor devices. With low impurity levels and high crystal quality, these wafers provide the ideal platform for developing high-performance electronics.
Available in various sizes and specifications, Semicera Silicon Wafers can be tailored to meet the specific needs of different industries, including computing, telecommunications, and renewable energy. Whether for large-scale manufacturing or specialized research, these wafers deliver reliable results.
Semicera is committed to supporting the growth and innovation of the semiconductor industry by providing high-quality silicon wafers that meet the highest industry standards. With a focus on precision and reliability, Semicera enables manufacturers to push the boundaries of technology, ensuring their products stay at the forefront of the market.
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항목 |
생산 |
연구 |
더미 |
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결정 매개 변수 |
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폴리 타입 |
4H |
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표면 방향 오류 |
4±0.15° |
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전기 매개 변수 |
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도펀트 |
N- 타입 질소 |
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저항 |
0.015-0.025ohm · cm |
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기계적 매개 변수 |
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지름 |
150.0 ± 0.2mm |
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두께 |
350 ± 25 µm |
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1 차 평평한 방향 |
[1-100]±5° |
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1 차 평평한 길이 |
47.5 ± 1.5mm |
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보조 아파트 |
없음 |
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TTV |
≤5 µm |
≤10 µm |
≤15 µm |
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LTV |
≤3 μm (5mm*5mm) |
≤5 μm (5mm*5mm) |
≤10 μm (5mm*5mm) |
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절하다 |
-15μm ~ 15μm |
-35μm ~ 35μm |
-45μm ~ 45μm |
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경사 |
≤35 µm |
≤45 µm |
≤55 µm |
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전면 (si-face) 거칠기 (AFM) |
Ra≤0.2nm (5μm*5μm) |
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구조 |
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마이크로 파이프 밀도 |
<1 EA/CM2 |
<10 EA/CM2 |
<15 EA/CM2 |
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금속 불순물 |
≤5E10atoms/cm2 |
NA |
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BPD |
≤1500 EA/CM2 |
≤3000 EA/CM2 |
NA |
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TSD |
≤500 EA/CM2 |
≤1000 EA/CM2 |
NA |
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프론트 품질 |
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앞쪽 |
시 |
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표면 마감 |
Si-Face CMP |
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입자 |
≤60EA/웨이퍼 (크기 0.3μm) |
NA |
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흠집 |
≤5EA/mm. 누적 길이 ≤ diameter |
누적 길이 ≤2*직경 |
NA |
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오렌지 껍질/구덩이/얼룩/줄무늬/균열/오염 |
없음 |
NA |
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에지 칩/인테이션/골절/육각 플레이트 |
없음 |
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폴리 타입 영역 |
없음 |
누적 면적 ≤20% |
누적 면적 ≤30% |
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전면 레이저 표시 |
없음 |
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뒤로 품질 |
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뒤로 마무리 |
C-Face CMP |
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흠집 |
≤5EA/mm, 누적 길이 ≤2*직경 |
NA |
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등 결함 (Edge Chips/Indents) |
없음 |
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뒤로 거칠기 |
Ra≤0.2nm (5μm*5μm) |
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뒤 레이저 표시 |
1 mm (상단 가장자리에서) |
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가장자리 |
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가장자리 |
모따기 |
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포장 |
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포장 |
진공 포장으로 에피 레디 멀티 웨이 커 카세트 포장 |
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*참고 :“NA”는 언급되지 않은 요청 항목이 Semi-STD를 참조 할 수 없음을 의미합니다. |
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