6 Inch N-type SiC Substrate

Semicera offers a wide range of 4H-8H SiC wafers. For many years, we have been a manufacturer and supplier of products to the semiconductor and photovoltaic industries. Our main products include: Silicon carbide etch plates, silicon carbide boat trailers, silicon carbide wafer boats (PV & Semiconductor), silicon carbide furnace tubes, silicon carbide cantilever paddles, silicon carbide chucks, silicon carbide beams, as well as CVD SiC coatings and TaC coatings. Covering most European and American markets. We look forward to being your long-term partner in China.

Silicon carbide (SiC) single crystal material has a large band gap width (~Si 3 times), high thermal conductivity (~Si 3.3 times or GaAs 10 times), high electron saturation migration rate (~Si 2.5 times), high breakdown electric field (~Si 10 times or GaAs 5 times) and other outstanding characteristics.

The third generation semiconductor materials mainly include SiC, GaN, diamond, etc., because its band gap width (Eg) is greater than or equal to 2.3 electron volts (eV), also known as wide band gap semiconductor materials. Compared with the first and second generation semiconductor materials, the third generation semiconductor materials have the advantages of high thermal conductivity, high breakdown electric field, high saturated electron migration rate and high bonding energy, which can meet the new requirements of modern electronic technology for high temperature, high power, high pressure, high frequency and radiation resistance and other harsh conditions. It has important application prospects in the fields of national defense, aviation, aerospace, oil exploration, optical storage, etc., and can reduce energy loss by more than 50% in many strategic industries such as broadband communications, solar energy, automobile manufacturing, semiconductor lighting, and smart grid, and can reduce equipment volume by more than 75%, which is of milestone significance for the development of human science and technology.

Semicera energy can provide customers with high-quality Conductive (Conductive), Semi-insulating (Semi-insulating), HPSI (High Purity semi-insulating) silicon carbide substrate; In addition, we can provide customers with homogeneous and heterogeneous silicon carbide epitaxial sheets; We can also customize the epitaxial sheet according to the specific needs of customers, and there is no minimum order quantity.

Rzeczy

Produkcja

Badania

Atrapa

Parametry kryształów

Polityp

4H

Błąd orientacji powierzchni

<11-20 >4±0.15°

Parametry elektryczne

Dopant

azot typu N.

Oporność

0.015-0.025ohm·cm

Parametry mechaniczne

Średnica

150.0±0.2mm

Grubość

350±25 μm

Pierwotna płaska orientacja

[1-100]±5°

Pierwotna płaska długość

47.5±1.5mm

Wtórne mieszkanie

Nic

TTV

≤5 μm

≤10 μm

≤15 μm

LTV

≤3 μm(5mm*5mm)

≤5 μm(5mm*5mm)

≤10 μm(5mm*5mm)

Ukłon

-15μm ~ 15μm

-35μm ~ 35μm

-45μm ~ 45μm

Osnowa

≤35 μm

≤45 μm

≤55 μm

Chropowatość z przodu (SI-FACE) (AFM)

Ra≤0.2nm (5μm*5μm)

Struktura

Gęstość mikropipe

<1 ea/cm2

<10 ea/cm2

<15 ea/cm2

Zanieczyszczenia metalowe

≤5E10atoms/cm2

Na

BPD

≤1500 ea/cm2

≤3000 ea/cm2

Na

TSD

≤500 ea/cm2

≤1000 ea/cm2

Na

Jakość z przodu

Przód

Si

Wykończenie powierzchni

SI-FACE CMP

Cząsteczki

≤60ea/wafer (size≥0.3μm)

Na

Zadrapania

≤5ea/mm. Cumulative length ≤Diameter

Cumulative length≤2*Diameter

Na

Skórka pomarańczowa/doły/plamy/prążki/pęknięcia/zanieczyszczenie

Nic

Na

Płyty krawędziowe/wkładki/złamanie/sześciokątne płyty

Nic

Obszary politypowe

Nic

Cumulative area≤20%

Cumulative area≤30%

Przednie oznaczenie lasera

Nic

Jakość wstecz

Wstecz

CMP-FACE CMP

Zadrapania

≤5ea/mm,Cumulative length≤2*Diameter

Na

Wady tylne (chipsy krawędziowe/wentylatory)

Nic

Chropowatość pleców

Ra≤0.2nm (5μm*5μm)

Oznaczenie lasera z tyłu

1 mm (od górnej krawędzi)

Krawędź

Krawędź

Ścięcie

Opakowanie

Opakowanie

Epi-gotowe z opakowaniem próżniowym

Opakowanie kaseta z wieloma falami

*Notes: “NA” means no request Items not mentioned may refer to SEMI-STD.

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