Gan Epitaxy

GaN Epitaxy is a cornerstone in the production of high-performance semiconductor devices, offering exceptional efficiency, thermal stability, and reliability. Semicera’s GaN Epitaxy solutions are tailored to meet the demands of cutting-edge applications, ensuring superior quality and consistency in every layer.

Półcesta proudly presents its cutting-edge Gan Epitaxy services, designed to meet the ever-evolving needs of the semiconductor industry. Gallium nitride (GaN) is a material known for its exceptional properties, and our epitaxial growth processes ensure that these benefits are fully realized in your devices.

High-Performance GaN Layers Półcesta specializes in the production of high-quality Gan Epitaxy layers, offering unparalleled material purity and structural integrity. These layers are critical for a variety of applications, from power electronics to optoelectronics, where superior performance and reliability are essential. Our precision growth techniques ensure that each GaN layer meets the exacting standards required for cutting-edge devices.

Optimized for Efficiency The Gan Epitaxy provided by Semicera is specifically engineered to enhance the efficiency of your electronic components. By delivering low-defect, high-purity GaN layers, we enable devices to operate at higher frequencies and voltages, with reduced power loss. This optimization is key for applications such as high-electron-mobility transistors (HEMTs) and light-emitting diodes (LEDs), where efficiency is paramount.

Versatile Application Potential Półcesta’s Gan Epitaxy is versatile, catering to a broad range of industries and applications. Whether you are developing power amplifiers, RF components, or laser diodes, our GaN epitaxial layers provide the foundation needed for high-performance, reliable devices. Our process can be tailored to meet specific requirements, ensuring that your products achieve optimal results.

Commitment to Quality Quality is the cornerstone of Półcesta’s approach to Gan Epitaxy. We use advanced epitaxial growth technologies and rigorous quality control measures to produce GaN layers that exhibit excellent uniformity, low defect densities, and superior material properties. This commitment to quality ensures that your devices not only meet but exceed industry standards.

Innovative Growth Techniques Półcesta is at the forefront of innovation in the field of Gan Epitaxy. Our team continuously explores new methods and technologies to improve the growth process, delivering GaN layers with enhanced electrical and thermal characteristics. These innovations translate into better-performing devices, capable of meeting the demands of next-generation applications.

Customized Solutions for Your Projects Recognizing that each project has unique requirements, Półcesta offers customized Gan Epitaxy solutions. Whether you need specific doping profiles, layer thicknesses, or surface finishes, we work closely with you to develop a process that meets your exact needs. Our goal is to provide you with GaN layers that are precisely engineered to support your device’s performance and reliability.

Rzeczy

Produkcja

Badania

Atrapa

Parametry kryształów

Polityp

4H

Błąd orientacji powierzchni

4±0.15°

Parametry elektryczne

Dopant

azot typu N.

Oporność

0,015-0,025OHM · cm

Parametry mechaniczne

Średnica

150,0 ± 0,2 mm

Grubość

350 ± 25 µm

Pierwotna płaska orientacja

[1-100]±5°

Pierwotna płaska długość

47,5 ± 1,5 mm

Wtórne mieszkanie

Nic

TTV

≤5 µm

≤10 µm

≤15 µm

LTV

≤3 μm (5 mm*5 mm)

≤5 μm (5 mm*5 mm)

≤10 μm (5 mm*5 mm)

Ukłon

-15 μm ~ 15 μm

-35 μm ~ 35 μm

-45 μm ~ 45 μm

Osnowa

≤35 µm

≤45 µm

≤55 µm

Chropowatość z przodu (SI-FACE) (AFM)

RA ≤ 0,2 nm (5 μm*5 μm)

Struktura

Gęstość mikropipe

<1 ea/cm2

<10 ea/cm2

<15 ea/cm2

Zanieczyszczenia metalowe

≤5E10atoms/cm2

Na

BPD

≤1500 EA/CM2

≤3000 EA/CM2

Na

TSD

≤500 EA/CM2

≤1000 EA/CM2

Na

Jakość z przodu

Przód

Si

Wykończenie powierzchni

SI-FACE CMP

Cząsteczki

≤60ea/wafel (rozmiar ≥0,3 μm)

Na

Zadrapania

≤5EA/mm. Kumulatywna długość ≤ -diameter

Skumulowana długość ≤2*średnica

Na

Skórka pomarańczowa/doły/plamy/prążki/pęknięcia/zanieczyszczenie

Nic

Na

Płyty krawędziowe/wkładki/złamanie/sześciokątne płyty

Nic

Obszary politypowe

Nic

Obszar skumulowany ≤20%

Obszar skumulowany ≤30%

Przednie oznaczenie lasera

Nic

Jakość wstecz

Wstecz

CMP-FACE CMP

Zadrapania

≤5EA/mm, kumulatywna długość ≤2*średnica

Na

Wady tylne (chipsy krawędziowe/wentylatory)

Nic

Chropowatość pleców

RA ≤ 0,2 nm (5 μm*5 μm)

Oznaczenie lasera z tyłu

1 mm (od górnej krawędzi)

Krawędź

Krawędź

Ścięcie

Opakowanie

Opakowanie

Epi-gotowe z opakowaniem próżniowym

Opakowanie kaseta z wieloma falami

*Uwagi : „Na” oznacza, że ​​brak wymienionych elementów, które nie wspomniane elementy mogą zapoznać się z pół-STD.

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