SiC Wafer Grinding Disc – Ra 0.2 μm High-Precision Surface Finish

Name: China SiC Wafer Grinding Disc – Ra 0.2 μm High-Precision Surface Finish Manufacturers
SKU: 0988

Silicon carbide grinding discs feature a low thermal expansion coefficient, high strength, high hardness, long service life, and relatively low cost. Their thermal expansion behavior closely matches that of silicon wafers, which helps prevent deformation and stress during processing. As a result, they can effectively meet the demanding requirements of high-precision grinding and polishing, improving both processing quality and efficiency. They are mainly used for precision polishing of silicon substrates in large-scale integrated circuits and silicon wafers in the photovoltaic industry.

Description

The silicon carbide ceramic grinding disc is a high-precision process equipment component designed for wafer manufacturing in the semiconductor industry. It is mainly used in ultra-large-scale integrated circuit (ULSI) silicon wafer grinding and polishing processes.

Compared with traditional cast iron or carbon steel grinding discs, SiC ceramic grinding discs offer superior dimensional stability, longer service life, and significantly reduced thermal deformation, making them more suitable for advanced wafer processing requirements.

Main Features

High hardness & excellent wear resistance: Ensures stable long-term operation under high-speed grinding conditions
Low thermal expansion coefficient: Closely matches silicon wafer materials, improving dimensional accuracy
High flatness & stability: Reduces deformation during processing, ensuring wafer parallelism and surface quality
Excellent thermal stability: Maintains mechanical performance under continuous processing conditions
High-temperature strength (up to ~1600°C): No significant strength degradation at elevated temperatures
Oxidation and corrosion resistance: Suitable for harsh industrial environments
Long service life: Reduces maintenance frequency and production cost

Applications

Silicon wafer grinding and polishing in semiconductor manufacturing
Ultra-large-scale integrated circuit (ULSI) wafer processing
Precision lapping and polishing of optical or flat substrate materials
High-precision surface finishing of ceramic, metal, or block materials
High-temperature structural components such as furnace top plates, supports, and experimental fixtures

Semicera

Semicera is a manufacturing-oriented enterprise specializing in the R&D, production, and sales of silicon carbide ceramic products. Since its establishment in 2016, the company has developed a complete in-house manufacturing capability, mastering multiple forming processes including isostatic pressing, high-tonnage pressing, slip casting, and vacuum extrusion.

Semicera operates 6 silicon carbide ceramic sintering production lines, along with 8 CNC machining centers and 6 precision grinding machines, enabling fully integrated production from raw forming to precision machining and finishing.

In addition to silicon carbide sintered components, the company also provides customized machining and manufacturing services for advanced ceramic materials, including silicon carbide ceramics, alumina ceramics, aluminum nitride ceramics, and zirconia ceramics, supporting high-precision, high-reliability industrial applications.