{"id":1479,"date":"2025-09-11T05:29:19","date_gmt":"2025-09-11T05:29:19","guid":{"rendered":"https:\/\/weitai2.globaldeepsea.site\/product\/wafer-handling-arm\/"},"modified":"2026-04-29T15:33:14","modified_gmt":"2026-04-29T07:33:14","slug":"wafer-handling-arm","status":"publish","type":"product","link":"https:\/\/www.cn-semiconductorparts.com\/pt\/product\/wafer-handling-arm\/","title":{"rendered":"Bra\u00e7o de manuseio de bolacha"},"content":{"rendered":"

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Wafer handling arm is a key equipment used in the semiconductor manufacturing process to handle, transfer and position wafers. It usually consists of a robotic arm, a gripper and a control system, with precise movement and positioning capabilities. Wafer handling arms are widely used in various links in semiconductor manufacturing, including process steps such as wafer loading, cleaning, thin film deposition, etching, lithography and inspection. Its precision, reliability and automation capabilities are essential to ensure the quality, efficiency and consistency of the production process.<\/p>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n

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As principais fun\u00e7\u00f5es do bra\u00e7o de manuseio de bolacha incluem:<\/p>\n

1. Transfer\u00eancia de wafer: O bra\u00e7o de manuseio de bolacha \u00e9 capaz de transferir com precis\u00e3o as bolachas de um local para outro, como levar as bolachas de um rack de armazenamento e coloc\u00e1 -las em um dispositivo de processamento.<\/p>\n

2. Posicionamento e orienta\u00e7\u00e3o: o bra\u00e7o de manuseio de bolacha \u00e9 capaz de posicionar e orientar com precis\u00e3o a bolacha para garantir o alinhamento e a posi\u00e7\u00e3o corretos para as opera\u00e7\u00f5es subsequentes de processamento ou medi\u00e7\u00e3o.<\/p>\n

3. Aperta\u00e7\u00e3o e libera\u00e7\u00e3o: os bra\u00e7os de manuseio de bolacha geralmente est\u00e3o equipados com garras que podem prender as bolachas com seguran\u00e7a e liber\u00e1 -las quando necess\u00e1rio para garantir transfer\u00eancia e manuseio seguros de bolachas.<\/p>\n

4 Controle automatizado: O bra\u00e7o de manuseio de bolacha est\u00e1 equipado com um sistema de controle avan\u00e7ado que pode executar automaticamente sequ\u00eancias de a\u00e7\u00e3o predeterminadas, melhorar a efici\u00eancia da produ\u00e7\u00e3o e reduzir os erros humanos.<\/p>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n

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\"Bra\u00e7o <\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n
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Caracter\u00edsticas e vantagens<\/p>\n

1.Precise Dimens\u00f5es e estabilidade t\u00e9rmica.<\/p>\n

2. Alta rigidez espec\u00edfica e excelente uniformidade t\u00e9rmica, o uso a longo prazo n\u00e3o \u00e9 f\u00e1cil de dobrar a deforma\u00e7\u00e3o.<\/p>\n

3. Tem uma superf\u00edcie lisa e boa resist\u00eancia ao desgaste, manuseando com seguran\u00e7a o chip sem contamina\u00e7\u00e3o por part\u00edculas.<\/p>\n

4.Silicon carbide resistivity in 106-108Ω, non-magnetic, in line with anti-ESD specification requirements; It can prevent the accumulation of static electricity on the surface of the chip.<\/p>\n

5. Boa condutividade t\u00e9rmica, baixo coeficiente de expans\u00e3o.<\/p>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n

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\"Local <\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n
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\"Local <\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n
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\"M\u00e1quina <\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n
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\"Processamento <\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n
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\"Ware <\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n
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\"Nosso <\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"

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Silicon Carbide Vacuum Chuck and Wafer Handling Arm is formed by isostatic pressing process and high temperature sintering. The external dimensions, thickness and shapes can be finished according to the user’s design drawings to meet the user’s specific requirements.<\/p>","protected":false},"featured_media":1147,"comment_status":"closed","ping_status":"open","template":"","meta":[],"product_brand":[],"product_cat":[37],"product_tag":[],"class_list":{"0":"post-1479","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-cvd-tac-coating","8":"first","9":"instock","10":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/product\/1479","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/comments?post=1479"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/media\/1147"}],"wp:attachment":[{"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/media?parent=1479"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/product_brand?post=1479"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/product_cat?post=1479"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/product_tag?post=1479"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}