{"id":2218,"date":"2025-09-11T05:33:27","date_gmt":"2025-09-11T05:33:27","guid":{"rendered":"https:\/\/weitai2.globaldeepsea.site\/product\/laser-microjet-cutting-lmj-equipment-can-be-used-in-the-semiconductor-industry\/"},"modified":"2026-04-29T15:28:09","modified_gmt":"2026-04-29T07:28:09","slug":"laser-microjet-cutting-lmj-equipment-can-be-used-in-the-semiconductor-industry","status":"publish","type":"product","link":"https:\/\/www.cn-semiconductorparts.com\/pt\/product\/laser-microjet-cutting-lmj-equipment-can-be-used-in-the-semiconductor-industry\/","title":{"rendered":"Laser microjet cutting (LMJ) equipment can be used in the semiconductor industry"},"content":{"rendered":"

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Vantagens do processamento de LMJ<\/span> <\/h3>\n<\/p><\/div>\n<\/p><\/div>\n
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Os defeitos inerentes ao processamento regular a laser podem ser superados pelo uso inteligente da tecnologia Micro Jet (LMJ) a laser a laser para propagar as caracter\u00edsticas \u00f3pticas da \u00e1gua e do ar. Essa tecnologia permite que os pulsos a laser refletiram totalmente no jato de \u00e1gua de alta pureza processado de maneira n\u00e3o perturbada para atingir a superf\u00edcie da usinagem como na fibra \u00f3ptica. <\/p>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n

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\"Equipamento <\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n
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\"fcghjdxfrg\" <\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n
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As principais caracter\u00edsticas da tecnologia LMJ s\u00e3o:<\/p>\n

1. O feixe de laser \u00e9 uma estrutura colunar (paralela).<\/p>\n

2. O pulso do laser \u00e9 transmitido no jato de \u00e1gua como uma fibra \u00f3ptica, sem nenhuma interfer\u00eancia ambiental.<\/p>\n

3. O feixe de laser est\u00e1 focado no equipamento LMJ, e a altura da superf\u00edcie usinada n\u00e3o muda durante todo o processo de processamento, portanto, n\u00e3o precisa continuar se concentrando na mudan\u00e7a da profundidade do processamento durante o processamento.<\/p>\n

4. Limpe a superf\u00edcie continuamente.<\/p>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n

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\"Micro-Jet <\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n
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5. Al\u00e9m da abla\u00e7\u00e3o do material da pe\u00e7a de trabalho por cada pulso do laser, a cada tempo unit\u00e1rio desde o in\u00edcio de cada pulso at\u00e9 o pr\u00f3ximo pulso, o material processado est\u00e1 no estado de \u00e1gua de resfriamento em tempo real por cerca de 99% da \u00e9poca, o que quase elimina a zona afetada pelo calor e a camada de remando, mas mant\u00e9m a alta efici\u00eancia do processamento.<\/p>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n

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\"ZSDFGAFDEG\" <\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n
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Especifica\u00e7\u00e3o geral<\/p>\n<\/td>\n

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LCSA-100<\/span><\/p>\n<\/td>\n

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LCSA-200<\/span><\/p>\n<\/td>\n<\/tr>\n

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Volume de bancada<\/span><\/p>\n<\/td>\n

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125 x 200 x 100<\/span><\/p>\n<\/td>\n

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460×460×300<\/span><\/p>\n<\/td>\n<\/tr>\n

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Eixo linear XY<\/span><\/p>\n<\/td>\n

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Motor linear. Motor linear<\/span><\/p>\n<\/td>\n

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Motor linear. Motor linear<\/span><\/p>\n<\/td>\n<\/tr>\n

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Eixo linear z<\/span><\/p>\n<\/td>\n

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100<\/span><\/p>\n<\/td>\n

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300<\/span><\/p>\n<\/td>\n<\/tr>\n

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Positioning accuracy μm<\/span><\/p>\n<\/td>\n

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+ \/ – 5<\/span><\/p>\n<\/td>\n

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+ \/ – 3<\/span><\/p>\n<\/td>\n<\/tr>\n

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Repeated positioning accuracy μm<\/span><\/p>\n<\/td>\n

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+ \/ – 2<\/span><\/p>\n<\/td>\n

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+ \/ – 1<\/span><\/p>\n<\/td>\n<\/tr>\n

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Acelera\u00e7\u00e3o g<\/span><\/p>\n<\/td>\n

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0.5<\/span><\/p>\n<\/td>\n

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1<\/span><\/p>\n<\/td>\n<\/tr>\n

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Controle num\u00e9rico<\/span><\/p>\n<\/td>\n

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3-axis<\/span><\/p>\n<\/td>\n

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3-axis<\/span><\/p>\n<\/td>\n<\/tr>\n

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L<\/span>ASER<\/span><\/p>\n<\/td>\n

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 <\/p>\n<\/td>\n

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 <\/p>\n<\/td>\n<\/tr>\n

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Tipo de laser<\/span><\/p>\n<\/td>\n

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DPSS ND: YAG<\/span><\/p>\n<\/td>\n

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DPSS nd: yag, pulso<\/span><\/p>\n<\/td>\n<\/tr>\n

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Comprimento de onda nm<\/span><\/p>\n<\/td>\n

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532\/1064<\/span><\/p>\n<\/td>\n

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532\/1064<\/span><\/p>\n<\/td>\n<\/tr>\n

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Poder nominal w<\/span><\/p>\n<\/td>\n

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50\/100\/200<\/span><\/p>\n<\/td>\n

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200\/400<\/span><\/p>\n<\/td>\n<\/tr>\n

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Jato de \u00e1gua<\/span><\/p>\n<\/td>\n

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 <\/p>\n<\/td>\n

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 <\/p>\n<\/td>\n<\/tr>\n

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Nozzle diameter μm<\/span><\/p>\n<\/td>\n

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25-80<\/span><\/p>\n<\/td>\n

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25-80<\/span><\/p>\n<\/td>\n<\/tr>\n

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Barra de press\u00e3o do bico<\/span><\/p>\n<\/td>\n

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100-600<\/span><\/p>\n<\/td>\n

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0-600<\/span><\/p>\n<\/td>\n<\/tr>\n

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Tamanho\/peso<\/span><\/p>\n<\/td>\n

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 <\/p>\n<\/td>\n

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 <\/p>\n<\/td>\n<\/tr>\n

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Dimens\u00f5es (m\u00e1quina)<\/span> (W x l x h)<\/span><\/p>\n<\/td>\n

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1050 x 800 x 1870<\/span><\/p>\n<\/td>\n

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1200 x 1200 x 2000<\/span><\/p>\n<\/td>\n<\/tr>\n

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Dimens\u00f5es (gabinete de controle) (w x l x h)<\/span><\/p>\n<\/td>\n

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700 x 2300 x 1600<\/span><\/p>\n<\/td>\n

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700 x 2300 x 1600<\/span><\/p>\n<\/td>\n<\/tr>\n

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Peso (equipamento) kg<\/span><\/p>\n<\/td>\n

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1170<\/span><\/p>\n<\/td>\n

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2500-3000<\/span><\/p>\n<\/td>\n<\/tr>\n

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Peso (gabinete de controle) kg<\/span><\/p>\n<\/td>\n

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700-750<\/span><\/p>\n<\/td>\n

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700-750<\/span><\/p>\n<\/td>\n<\/tr>\n

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Consumo abrangente de energia<\/span><\/p>\n<\/td>\n

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 <\/p>\n<\/td>\n

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 <\/p>\n<\/td>\n<\/tr>\n

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I<\/span>nput<\/span><\/p>\n<\/td>\n

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AC 230 V +6%\/ -10%, unidirectional 50\/60 Hz ±1%<\/span><\/p>\n<\/td>\n

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AC 400 V +6%\/-10%, 3-phase50\/60 Hz ±1%<\/span><\/p>\n<\/td>\n<\/tr>\n

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Valor de pico<\/span><\/p>\n<\/td>\n

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2.5kVA<\/span><\/p>\n<\/td>\n

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2.5kVA<\/span><\/p>\n<\/td>\n<\/tr>\n

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J<\/span>oin<\/span><\/p>\n<\/td>\n

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Cabo de energia de 10 m: p+n+e, 1,5 mm2<\/span><\/p>\n<\/td>\n

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Cabo de energia de 10 m: p+n+e, 1,5 mm2<\/span><\/p>\n<\/td>\n<\/tr>\n

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Faixa de aplicativos de usu\u00e1rios do setor de semicondutores<\/span><\/p>\n<\/td>\n

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≤4 inches round ingot<\/span><\/p>\n

≤4 inches ingot slices<\/span><\/p>\n

≤4 inches ingot scribing<\/span><\/p>\n

 <\/p>\n<\/td>\n

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≤6 inches round ingot<\/span><\/p>\n

≤6 inch ingot slices<\/span><\/p>\n

≤6 inches ingot scribing<\/span><\/p>\n

A m\u00e1quina atende ao valor te\u00f3rico circular\/fatiando\/fatiamento de 8 polegadas, e os resultados pr\u00e1ticos espec\u00edficos precisam ser otimizados de estrat\u00e9gia de corte<\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n

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\"ZFVBSDF\" <\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n
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\"Micro-Jet <\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n
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\"Micro-Jet <\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n
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\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"

<\/p>\n

Laser microjet technology (LMJ) is a laser processing method that combines laser with a water jet “as thin as a hair”, and precisely guides the laser beam to the processing position through the pulse total reflection in the micro-water jet in a way similar to traditional optical fiber. The water jet continuously cools the cutting area and effectively removes processing debris.<\/p>","protected":false},"featured_media":636,"comment_status":"closed","ping_status":"open","template":"","meta":[],"product_brand":[],"product_cat":[31,40],"product_tag":[],"class_list":{"0":"post-2218","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-more-ceramic-products","7":"product_cat-more-products","9":"first","10":"instock","11":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/product\/2218","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/comments?post=2218"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/media\/636"}],"wp:attachment":[{"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/media?parent=2218"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/product_brand?post=2218"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/product_cat?post=2218"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.cn-semiconductorparts.com\/pt\/wp-json\/wp\/v2\/product_tag?post=2218"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}