4″6″ 8″ N-type SiC Ingot

Semicera’s 4″, 6″, and 8″ N-type SiC Ingots are the cornerstone for high-power and high-frequency semiconductor devices. Offering superior electrical properties and thermal conductivity, these ingots are crafted to support the production of reliable and efficient electronic components. Trust Semicera for unmatched quality and performance.

Semicera’s 4″, 6″, and 8″ N-type SiC Ingots represent a breakthrough in semiconductor materials, designed to meet the increasing demands of modern electronic and power systems. These ingots provide a robust and stable foundation for various semiconductor applications, ensuring optimal performance and longevity.

Our N-type SiC ingots are produced using advanced manufacturing processes that enhance their electrical conductivity and thermal stability. This makes them ideal for high-power and high-frequency applications, such as inverters, transistors, and other power electronic devices where efficiency and reliability are paramount.

The precise doping of these ingots ensures that they offer consistent and repeatable performance. This consistency is critical for developers and manufacturers who are pushing the boundaries of technology in fields like aerospace, automotive, and telecommunications. Semicera’s SiC ingots enable the production of devices that operate efficiently under extreme conditions.

Choosing Semicera’s N-type SiC Ingots means integrating materials that can handle high temperatures and high electrical loads with ease. These ingots are particularly suited for creating components that require excellent thermal management and high-frequency operation, such as RF amplifiers and power modules.

By opting for Semicera’s 4″, 6″, and 8″ N-type SiC Ingots, you are investing in a product that combines exceptional material properties with the precision and reliability demanded by cutting-edge semiconductor technologies. Semicera continues to lead the industry by providing innovative solutions that drive the advancement of electronic device manufacturing. 

Artikel

Produktion

Forschung

Dummy

Kristallparameter

Polytype

4H

Oberflächenorientierungsfehler

4±0.15°

Elektrische Parameter

Dopant

Stickstoff vom Typ N

Widerstand

0,015-0.025OHM · cm

Mechanische Parameter

Durchmesser

150,0 ± 0,2 mm

Dicke

350 ± 25 µm

Primäre flache Orientierung

[1-100]±5°

Primäre flache Länge

47,5 ± 1,5 mm

Sekundäre flache

Keiner

Ttv

≤5 µm

≤10 µm

≤15 µm

LTV

≤3 μm (5 mm*5 mm)

≤5 μm (5 mm*5 mm)

≤10 μm (5 mm*5 mm)

Bogen

-15 μm ~ 15 μm

-35 μm ~ 35 μm

-45 μm ~ 45 μm

Kette

≤35 µm

≤45 µm

≤55 µm

Front (Si-Face) Rauheit (AFM)

Ra ≤ 0,2 nm (5 & mgr; m*5 μm)

Struktur

Mikropipe -Dichte

<1 EA/CM2

<10 EA/CM2

<15 EA/CM2

Metallverunreinigungen

≤5E10atoms/cm2

N / A

BPD

≤1500 EA/CM2

≤3000 EA/CM2

N / A

TSD

≤500 EA/CM2

≤1000 EA/CM2

N / A

Frontqualität

Front

Si

Oberflächenbeschaffung

Si-Face CMP

Partikel

≤60ea/Wafer (Größe ≥ 0,3 μm)

N / A

Kratzer

≤5ea/mm. Kumulative Länge ≤ Diameter

Kumulative Länge ≤ 2*Durchmesser

N / A

Orangenschale/Pits/Flecken/Streifen/Risse/Kontamination

Keiner

N / A

Kantenchips/Eingeweide/Fraktur-/Sechskantplatten

Keiner

Polytyperbereiche

Keiner

Kumulative Fläche ≤ 2010TP3T

Kumulative Fläche ≤ 30%

Frontlasermarkierung

Keiner

Rückenqualität

Rückbeschluss

C-Face CMP

Kratzer

≤5ea/mm, kumulative Länge ≤ 2*Durchmesser

N / A

Rückenfehler (Kantenchips/Eingebiete)

Keiner

Rückenrauheit

Ra ≤ 0,2 nm (5 & mgr; m*5 μm)

Rückmarkierung von Laser

1 mm (von der Oberkante)

Rand

Rand

Chamfer

Packaging

Packaging

Epi-ready with vacuum packaging

Multi-wafer cassette packaging

*Notes: “NA” means no request Items not mentioned may refer to SEMI-STD.

tech_1_2_size

SiC wafers

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