4 ″ galliumoxide -substraten

4″ Gallium Oxide Substrates– Unlock new levels of efficiency and performance in power electronics and UV devices with Semicera’s high-quality 4″ Gallium Oxide Substrates, designed for cutting-edge semiconductor applications.

Semicera proudly introduces its 4″ Gallium Oxide Substrates, a groundbreaking material engineered to meet the growing demands of high-performance semiconductor devices. Gallium Oxide (Ga2O3) substrates offer an ultra-wide bandgap, making them ideal for next-generation power electronics, UV optoelectronics, and high-frequency devices.

 

Belangrijke functies:

     • Ultra-Wide Bandgap: De 4″ Gallium Oxide Substrates boast a bandgap of approximately 4.8 eV, allowing for exceptional voltage and temperature tolerance, significantly outperforming traditional semiconductor materials like silicon.

     • High Breakdown Voltage: These substrates enable devices to operate at higher voltages and powers, making them perfect for high-voltage applications in power electronics.

     • Superior Thermal Stability: Gallium Oxide substrates offer excellent thermal conductivity, ensuring stable performance under extreme conditions, ideal for use in demanding environments.

     • High Material Quality: With low defect densities and high crystal quality, these substrates ensure reliable and consistent performance, enhancing the efficiency and durability of your devices.

     • Versatile Application: Suitable for a wide range of applications, including power transistors, Schottky diodes, and UV-C LED devices, enabling innovations in both power and optoelectronic fields.

 

Explore the future of semiconductor technology with Semicera’s 4″ Gallium Oxide Substrates. Our substrates are designed to support the most advanced applications, providing the reliability and efficiency required for today’s cutting-edge devices. Trust Semicera for quality and innovation in your semiconductor materials.

Items

Productie

Onderzoek

Stom

Kristalparameters

Polytype

4H

Oppervlakte -oriëntatiefout

4±0.15°

Elektrische parameters

Dopant

n-type stikstof

Weerstand

0.015-0.025OHM · cm

Mechanische parameters

Diameter

150,0 ± 0,2 mm

Dikte

350 ± 25 µm

Primaire platte oriëntatie

[1-100]±5°

Primaire platte lengte

47,5 ± 1,5 mm

Secundaire flat

Geen

TTV

≤5 µm

≤10 µm

≤15 µm

LTV

≤3 μm (5 mm*5 mm)

≤5 μm (5 mm*5 mm)

≤10 μm (5 mm*5 mm)

Boog

-15 μm ~ 15 μm

-35 μm ~ 35 μm

-45μm ~ 45 urm

Kronkelen

≤35 µm

≤45 µm

≤55 µm

Voorste (si-face) ruwheid (AFM)

Ra≤0,2 nm (5μm*5μm)

Structuur

Micropipe dichtheid

<1 EA/CM2

<10 EA/CM2

<15 EA/CM2

Metaalonzuiverheden

≤5E10atoms/cm2

NA

BPD

≤1500 EA/CM2

≤3000 EA/CM2

NA

TSD

≤500 EA/CM2

≤1000 EA/CM2

NA

Voorste kwaliteit

Voorkant

Si

Oppervlakte -afwerking

Si-face CMP

Deeltjes

≤60EA/wafer (grootte ≥ 0,3 μm)

NA

Krassen

≤5EA/mm. Cumulatieve lengte ≤diameter

Cumulatieve lengte ≤2*diameter

NA

Sinaasappelschil/putten/vlekken/strepen/scheuren/besmetting

Geen

NA

Edge -chips/inspringen/breuk/hexplaten

Geen

Polytype -gebieden

Geen

Cumulatief gebied ≤20%

Cumulatief gebied ≤30%

Laser markering vooraan

Geen

Rugkwaliteit

Back Finish

C-gezicht CMP

Krassen

≤5ea/mm, cumulatieve lengte ≤2*diameter

NA

Achterafwijkingen (randchips/inspringen)

Geen

Terug ruwheid

Ra≤0,2 nm (5μm*5μm)

Lasergrondbekleding

1 mm (van bovenrand)

Rand

Rand

Schuif

Verpakking

Verpakking

Epi-ready met vacuümverpakkingen

Multi-wafer cassette verpakking

*OPMERKINGEN: "NA" betekent dat er geen aanvraagitems die niet worden genoemd, verwijzen naar semi-STD.

tech_1_2_size

Sic wafels

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