4″6″ 8″ N-type SiC Ingot

Semicera’s 4″, 6″, and 8″ N-type SiC Ingots are the cornerstone for high-power and high-frequency semiconductor devices. Offering superior electrical properties and thermal conductivity, these ingots are crafted to support the production of reliable and efficient electronic components. Trust Semicera for unmatched quality and performance.

Semicera’s 4″, 6″, and 8″ N-type SiC Ingots represent a breakthrough in semiconductor materials, designed to meet the increasing demands of modern electronic and power systems. These ingots provide a robust and stable foundation for various semiconductor applications, ensuring optimal performance and longevity.

Our N-type SiC ingots are produced using advanced manufacturing processes that enhance their electrical conductivity and thermal stability. This makes them ideal for high-power and high-frequency applications, such as inverters, transistors, and other power electronic devices where efficiency and reliability are paramount.

The precise doping of these ingots ensures that they offer consistent and repeatable performance. This consistency is critical for developers and manufacturers who are pushing the boundaries of technology in fields like aerospace, automotive, and telecommunications. Semicera’s SiC ingots enable the production of devices that operate efficiently under extreme conditions.

Choosing Semicera’s N-type SiC Ingots means integrating materials that can handle high temperatures and high electrical loads with ease. These ingots are particularly suited for creating components that require excellent thermal management and high-frequency operation, such as RF amplifiers and power modules.

By opting for Semicera’s 4″, 6″, and 8″ N-type SiC Ingots, you are investing in a product that combines exceptional material properties with the precision and reliability demanded by cutting-edge semiconductor technologies. Semicera continues to lead the industry by providing innovative solutions that drive the advancement of electronic device manufacturing. 

Items

Productie

Onderzoek

Stom

Kristalparameters

Polytype

4H

Oppervlakte -oriëntatiefout

4±0.15°

Elektrische parameters

Dopant

n-type stikstof

Weerstand

0.015-0.025OHM · cm

Mechanische parameters

Diameter

150,0 ± 0,2 mm

Dikte

350 ± 25 µm

Primaire platte oriëntatie

[1-100]±5°

Primaire platte lengte

47,5 ± 1,5 mm

Secundaire flat

Geen

TTV

≤5 µm

≤10 µm

≤15 µm

LTV

≤3 μm (5 mm*5 mm)

≤5 μm (5 mm*5 mm)

≤10 μm (5 mm*5 mm)

Boog

-15 μm ~ 15 μm

-35 μm ~ 35 μm

-45μm ~ 45 urm

Kronkelen

≤35 µm

≤45 µm

≤55 µm

Voorste (si-face) ruwheid (AFM)

Ra≤0,2 nm (5μm*5μm)

Structuur

Micropipe dichtheid

<1 EA/CM2

<10 EA/CM2

<15 EA/CM2

Metaalonzuiverheden

≤5E10atoms/cm2

NA

BPD

≤1500 EA/CM2

≤3000 EA/CM2

NA

TSD

≤500 EA/CM2

≤1000 EA/CM2

NA

Voorste kwaliteit

Voorkant

Si

Oppervlakte -afwerking

Si-face CMP

Deeltjes

≤60EA/wafer (grootte ≥ 0,3 μm)

NA

Krassen

≤5EA/mm. Cumulatieve lengte ≤diameter

Cumulatieve lengte ≤2*diameter

NA

Sinaasappelschil/putten/vlekken/strepen/scheuren/besmetting

Geen

NA

Edge -chips/inspringen/breuk/hexplaten

Geen

Polytype -gebieden

Geen

Cumulatief gebied ≤20%

Cumulatief gebied ≤30%

Laser markering vooraan

Geen

Rugkwaliteit

Back Finish

C-gezicht CMP

Krassen

≤5ea/mm, cumulatieve lengte ≤2*diameter

NA

Achterafwijkingen (randchips/inspringen)

Geen

Terug ruwheid

Ra≤0,2 nm (5μm*5μm)

Lasergrondbekleding

1 mm (van bovenrand)

Rand

Rand

Schuif

Verpakking

Verpakking

Epi-ready met vacuümverpakkingen

Multi-wafer cassette verpakking

*OPMERKINGEN: "NA" betekent dat er geen aanvraagitems die niet worden genoemd, verwijzen naar semi-STD.

tech_1_2_size

Sic wafels

Nieuwbrief

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