Semicera’s 4″, 6″, and 8″ N-type SiC Ingots are the cornerstone for high-power and high-frequency semiconductor devices. Offering superior electrical properties and thermal conductivity, these ingots are crafted to support the production of reliable and efficient electronic components. Trust Semicera for unmatched quality and performance.
Semicera’s 4″, 6″, and 8″ N-type SiC Ingots represent a breakthrough in semiconductor materials, designed to meet the increasing demands of modern electronic and power systems. These ingots provide a robust and stable foundation for various semiconductor applications, ensuring optimal performance and longevity.
Our N-type SiC ingots are produced using advanced manufacturing processes that enhance their electrical conductivity and thermal stability. This makes them ideal for high-power and high-frequency applications, such as inverters, transistors, and other power electronic devices where efficiency and reliability are paramount.
The precise doping of these ingots ensures that they offer consistent and repeatable performance. This consistency is critical for developers and manufacturers who are pushing the boundaries of technology in fields like aerospace, automotive, and telecommunications. Semicera’s SiC ingots enable the production of devices that operate efficiently under extreme conditions.
Choosing Semicera’s N-type SiC Ingots means integrating materials that can handle high temperatures and high electrical loads with ease. These ingots are particularly suited for creating components that require excellent thermal management and high-frequency operation, such as RF amplifiers and power modules.
By opting for Semicera’s 4″, 6″, and 8″ N-type SiC Ingots, you are investing in a product that combines exceptional material properties with the precision and reliability demanded by cutting-edge semiconductor technologies. Semicera continues to lead the industry by providing innovative solutions that drive the advancement of electronic device manufacturing.
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Items |
Productie |
Onderzoek |
Stom |
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Kristalparameters |
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Polytype |
4H |
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Oppervlakte -oriëntatiefout |
4±0.15° |
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Elektrische parameters |
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Dopant |
n-type stikstof |
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Weerstand |
0.015-0.025OHM · cm |
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Mechanische parameters |
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Diameter |
150,0 ± 0,2 mm |
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Dikte |
350 ± 25 µm |
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Primaire platte oriëntatie |
[1-100]±5° |
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Primaire platte lengte |
47,5 ± 1,5 mm |
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Secundaire flat |
Geen |
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TTV |
≤5 µm |
≤10 µm |
≤15 µm |
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LTV |
≤3 μm (5 mm*5 mm) |
≤5 μm (5 mm*5 mm) |
≤10 μm (5 mm*5 mm) |
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Boog |
-15 μm ~ 15 μm |
-35 μm ~ 35 μm |
-45μm ~ 45 urm |
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Kronkelen |
≤35 µm |
≤45 µm |
≤55 µm |
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Voorste (si-face) ruwheid (AFM) |
Ra≤0,2 nm (5μm*5μm) |
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Structuur |
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Micropipe dichtheid |
<1 EA/CM2 |
<10 EA/CM2 |
<15 EA/CM2 |
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Metaalonzuiverheden |
≤5E10atoms/cm2 |
NA |
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BPD |
≤1500 EA/CM2 |
≤3000 EA/CM2 |
NA |
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TSD |
≤500 EA/CM2 |
≤1000 EA/CM2 |
NA |
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Voorste kwaliteit |
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Voorkant |
Si |
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Oppervlakte -afwerking |
Si-face CMP |
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Deeltjes |
≤60EA/wafer (grootte ≥ 0,3 μm) |
NA |
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Krassen |
≤5EA/mm. Cumulatieve lengte ≤diameter |
Cumulatieve lengte ≤2*diameter |
NA |
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Sinaasappelschil/putten/vlekken/strepen/scheuren/besmetting |
Geen |
NA |
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Edge -chips/inspringen/breuk/hexplaten |
Geen |
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Polytype -gebieden |
Geen |
Cumulatief gebied ≤20% |
Cumulatief gebied ≤30% |
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Laser markering vooraan |
Geen |
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Rugkwaliteit |
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Back Finish |
C-gezicht CMP |
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Krassen |
≤5ea/mm, cumulatieve lengte ≤2*diameter |
NA |
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Achterafwijkingen (randchips/inspringen) |
Geen |
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Terug ruwheid |
Ra≤0,2 nm (5μm*5μm) |
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Lasergrondbekleding |
1 mm (van bovenrand) |
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Rand |
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Rand |
Schuif |
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Verpakking |
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Verpakking |
Epi-ready met vacuümverpakkingen Multi-wafer cassette verpakking |
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*OPMERKINGEN: "NA" betekent dat er geen aanvraagitems die niet worden genoemd, verwijzen naar semi-STD. |
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