Silicon Carbide Epitaxy

Silicon Carbide Epitaxy– High-quality epitaxial layers tailored for advanced semiconductor applications, offering superior performance and reliability for power electronics and optoelectronic devices.

Semicera’s Silicon Carbide Epitaxy is engineered to meet the rigorous demands of modern semiconductor applications. By utilizing advanced epitaxial growth techniques, we ensure that each silicon carbide layer exhibits exceptional crystalline quality, uniformity, and minimal defect density. These characteristics are crucial for developing high-performance power electronics, where efficiency and thermal management are paramount.

The Silicon Carbide Epitaxy process at Semicera is optimized to produce epitaxial layers with precise thickness and doping control, ensuring consistent performance across a range of devices. This level of precision is essential for applications in electric vehicles, renewable energy systems, and high-frequency communications, where reliability and efficiency are critical.

Moreover, Semicera’s Silicon Carbide Epitaxy offers enhanced thermal conductivity and higher breakdown voltage, making it the preferred choice for devices that operate under extreme conditions. These properties contribute to longer device lifetimes and improved overall system efficiency, particularly in high-power and high-temperature environments.

Semicera also provides customization options for Silicon Carbide Epitaxy, allowing for tailored solutions that meet specific device requirements. Whether for research or large-scale production, our epitaxial layers are designed to support the next generation of semiconductor innovations, enabling the development of more powerful, efficient, and reliable electronic devices.

By integrating cutting-edge technology and stringent quality control processes, Semicera ensures that our Silicon Carbide Epitaxy products not only meet but exceed industry standards. This commitment to excellence makes our epitaxial layers the ideal foundation for advanced semiconductor applications, paving the way for breakthroughs in power electronics and optoelectronics.

Items

Productie

Onderzoek

Stom

Kristalparameters

Polytype

4H

Oppervlakte -oriëntatiefout

4±0.15°

Elektrische parameters

Dopant

n-type stikstof

Weerstand

0.015-0.025OHM · cm

Mechanische parameters

Diameter

150,0 ± 0,2 mm

Dikte

350 ± 25 µm

Primaire platte oriëntatie

[1-100]±5°

Primaire platte lengte

47,5 ± 1,5 mm

Secundaire flat

Geen

TTV

≤5 µm

≤10 µm

≤15 µm

LTV

≤3 μm (5 mm*5 mm)

≤5 μm (5 mm*5 mm)

≤10 μm (5 mm*5 mm)

Boog

-15 μm ~ 15 μm

-35 μm ~ 35 μm

-45μm ~ 45 urm

Kronkelen

≤35 µm

≤45 µm

≤55 µm

Voorste (si-face) ruwheid (AFM)

Ra≤0,2 nm (5μm*5μm)

Structuur

Micropipe dichtheid

<1 EA/CM2

<10 EA/CM2

<15 EA/CM2

Metaalonzuiverheden

≤5E10atoms/cm2

NA

BPD

≤1500 EA/CM2

≤3000 EA/CM2

NA

TSD

≤500 EA/CM2

≤1000 EA/CM2

NA

Voorste kwaliteit

Voorkant

Si

Oppervlakte -afwerking

Si-face CMP

Deeltjes

≤60EA/wafer (grootte ≥ 0,3 μm)

NA

Krassen

≤5EA/mm. Cumulatieve lengte ≤diameter

Cumulatieve lengte ≤2*diameter

NA

Sinaasappelschil/putten/vlekken/strepen/scheuren/besmetting

Geen

NA

Edge -chips/inspringen/breuk/hexplaten

Geen

Polytype -gebieden

Geen

Cumulatief gebied ≤20%

Cumulatief gebied ≤30%

Laser markering vooraan

Geen

Rugkwaliteit

Back Finish

C-gezicht CMP

Krassen

≤5ea/mm, cumulatieve lengte ≤2*diameter

NA

Achterafwijkingen (randchips/inspringen)

Geen

Terug ruwheid

Ra≤0,2 nm (5μm*5μm)

Lasergrondbekleding

1 mm (van bovenrand)

Rand

Rand

Schuif

Verpakking

Verpakking

Epi-ready met vacuümverpakkingen

Multi-wafer cassette verpakking

*OPMERKINGEN: "NA" betekent dat er geen aanvraagitems die niet worden genoemd, verwijzen naar semi-STD.

tech_1_2_size

Sic wafels

Nieuwbrief

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