ALD has the following characteristics and advantages:
1. High controllability: Since ALD is a layer-by-layer growth process, the thickness and composition of each layer of material can be precisely controlled.
2. Uniformity: ALD can deposit materials uniformly on the entire substrate surface, avoiding the unevenness that may occur in other deposition technologies.
3. Non-porous structure: Since ALD is deposited in units of single atoms or single molecules, the resulting film usually has a dense, non-porous structure.
4. Good coverage performance: ALD can effectively cover high aspect ratio structures, such as nanopore arrays, high porosity materials, etc.
5. Scalability: ALD can be used for a variety of substrate materials, including metals, semiconductors, glass, etc.
6. Versatility: By selecting different precursor molecules, a variety of different materials can be deposited in the ALD process, such as metal oxides, sulfides, nitrides, etc.