Semicera’s Silicon Carbide Mirror (SiC Mirror) is a high-performance precision ceramic component designed for advanced optical and semiconductor applications. Manufactured from high-density silicon carbide ceramic, the mirror substrate combines excellent mechanical strength, lightweight characteristics, high thermal conductivity, and outstanding dimensional stability.
Silicon carbide is one of the hardest engineering ceramics available, with a Vickers hardness of approximately HV2500, second only to diamond. Due to its high hardness and brittleness, precision machining requires advanced manufacturing technology. Semicera utilizes CNC precision machining and grinding processes to achieve exceptional dimensional accuracy and surface quality. During internal and external cylindrical grinding, dimensional tolerances can be controlled within ±0.005 mm, while roundness can be maintained within ±0.005 mm. Finished components feature smooth surfaces without burrs, pores, or cracks, with a surface roughness as low as Ra 0.1 μm.
Because silicon (Si) and silicon carbide (SiC) exhibit excellent thermal compatibility and can be polished to optical-grade surface finishes, they are widely used in the fabrication of lightweight optical mirrors and high-precision reflective systems.
Semicera’s Vacuum Adsorption Platform is designed for high-precision industrial processing applications, featuring a lightweight aluminum honeycomb structure combined with excellent flatness and load-bearing capability. The platform can be manufactured in sizes up to 1950 × 3950 mm, with larger dimensions available through modular splicing. Precision machining ensures outstanding surface flatness and rigidity, while the optimized vacuum channel design provides strong and uniform suction across the entire working area. Surface treatments such as PVDF coating, anodizing, and hard anodizing can be applied according to application requirements, offering enhanced wear resistance and durability. The platform supports full customization, including dimensions, vacuum hole layout, suction zones, interface configurations, and vacuum port arrangements, making it suitable for semiconductor, photovoltaic, display panel, precision machining, and automated manufacturing industries.
