GaN Epitaxy is a cornerstone in the production of high-performance semiconductor devices, offering exceptional efficiency, thermal stability, and reliability. Semicera’s GaN Epitaxy solutions are tailored to meet the demands of cutting-edge applications, ensuring superior quality and consistency in every layer.
شبه proudly presents its cutting-edge GaN Epitaxy services, designed to meet the ever-evolving needs of the semiconductor industry. Gallium nitride (GaN) is a material known for its exceptional properties, and our epitaxial growth processes ensure that these benefits are fully realized in your devices.
High-Performance GaN Layers شبه specializes in the production of high-quality GaN Epitaxy layers, offering unparalleled material purity and structural integrity. These layers are critical for a variety of applications, from power electronics to optoelectronics, where superior performance and reliability are essential. Our precision growth techniques ensure that each GaN layer meets the exacting standards required for cutting-edge devices.
Optimized for Efficiency The GaN Epitaxy provided by Semicera is specifically engineered to enhance the efficiency of your electronic components. By delivering low-defect, high-purity GaN layers, we enable devices to operate at higher frequencies and voltages, with reduced power loss. This optimization is key for applications such as high-electron-mobility transistors (HEMTs) and light-emitting diodes (LEDs), where efficiency is paramount.
Versatile Application Potential شبه’s GaN Epitaxy is versatile, catering to a broad range of industries and applications. Whether you are developing power amplifiers, RF components, or laser diodes, our GaN epitaxial layers provide the foundation needed for high-performance, reliable devices. Our process can be tailored to meet specific requirements, ensuring that your products achieve optimal results.
Commitment to Quality Quality is the cornerstone of شبه’s approach to GaN Epitaxy. We use advanced epitaxial growth technologies and rigorous quality control measures to produce GaN layers that exhibit excellent uniformity, low defect densities, and superior material properties. This commitment to quality ensures that your devices not only meet but exceed industry standards.
Innovative Growth Techniques شبه is at the forefront of innovation in the field of GaN Epitaxy. Our team continuously explores new methods and technologies to improve the growth process, delivering GaN layers with enhanced electrical and thermal characteristics. These innovations translate into better-performing devices, capable of meeting the demands of next-generation applications.
Customized Solutions for Your Projects Recognizing that each project has unique requirements, شبه offers customized GaN Epitaxy solutions. Whether you need specific doping profiles, layer thicknesses, or surface finishes, we work closely with you to develop a process that meets your exact needs. Our goal is to provide you with GaN layers that are precisely engineered to support your device’s performance and reliability.
أغراض |
إنتاج |
بحث |
دمية |
المعلمات البلورية |
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polytype |
4H |
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خطأ في اتجاه السطح |
4±0.15° |
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المعلمات الكهربائية |
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Dopant |
نيتروجين من النوع |
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المقاومة |
0.015-0.025OHM · سم |
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المعلمات الميكانيكية |
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قطر |
150.0 ± 0.2mm |
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سماكة |
350 ± 25 ميكرون |
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الاتجاه المسطح الأولي |
[1-100]±5° |
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طول مسطح أساسي |
47.5 ± 1.5mm |
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شقة ثانوية |
لا أحد |
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TTV |
≤5 ميكرون |
≤10 ميكرون |
≤15 ميكرون |
LTV |
≤3 ميكرون (5 ملم*5 ملم) |
≤5 ميكرون (5 ملم*5 ملم) |
≤10 ميكرون (5 ملم*5 ملم) |
قَوس |
-15μm ~ 15μm |
-35μm ~ 35μm |
-45μm ~ 45μm |
الاعوجاج |
≤35 ميكرون |
≤45 ميكرون |
≤55 ميكرون |
الخشونة الأمامية (si-face) (AFM) |
Ra≤0.2nm (5μm*5μm) |
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بناء |
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كثافة micropipe |
<1 EA/CM2 |
<10 EA/CM2 |
<15 EA/CM2 |
الشوائب المعدنية |
≤5E10atoms/cm2 |
نا |
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BPD |
≤1500 EA/CM2 |
≤3000 EA/CM2 |
نا |
TSD |
≤500 EA/CM2 |
≤1000 EA/CM2 |
نا |
الجودة الأمامية |
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أمام |
سي |
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الانتهاء من السطح |
Si-Face CMP |
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الجزيئات |
≤60A/WEFR (SIZE 30.3μM) |
نا |
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الخدوش |
≤5ea/مم. الطول التراكمي ≤Diameter |
الطول التراكمي ≤2*القطر |
نا |
قشر البرتقال/الحفر/البقع/الدماغ/الشقوق/التلوث |
لا أحد |
نا |
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رقائق الحافة/المسافات البادئة/الكسر/الألواح السداسية |
لا أحد |
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المناطق polytype |
لا أحد |
منطقة تراكمية 20% |
التراكمية منطقة ≤30% |
وضع علامة ليزر الأمامية |
لا أحد |
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جودة الظهر |
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الانتهاء من الظهر |
C-Face CMP |
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الخدوش |
≤5EA/MM ، الطول التراكمي ≤2*القطر |
نا |
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عيوب الظهر (رقائق الحافة/المسافات البادئة) |
لا أحد |
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خشونة الظهر |
Ra≤0.2nm (5μm*5μm) |
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عودة ليزر العلامات |
1 مم (من الحافة العليا) |
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حافة |
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حافة |
شامفر |
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التغليف |
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التغليف |
جاهز لـ EPI مع تغليف فراغ عبوات الكاسيت متعددة الفرس |
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*الملاحظات : "NA" تعني عدم وجود عناصر طلب لم يتم ذكرها قد تشير إلى Semi. |